BT850 Series Bluetooth Module

Recommended for New Design (RND)

Overview

The BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low Energy support. The Bluetooth 5 core specification shortens your development time and provides enhanced throughput, security and privacy. The BT850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and Cypress' GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.

These modules present a Bluetooth standard HCI interface with native support for Windows, Linux and Android Bluetooth software stacks for operating system backed devices. The BT851 Pluggable USB Adapter simply plugs into any Windows, Android or Linux device via external USB connection. Additionally, Laird has partnered with SEARAN for support of their ultra small, flexible ‘dotstack’ platform for embedded Cortex M3 and M4 implementations. 

Two form factors: BT850 Module or BT851 packaged USB Adapter.

 

 

Specifications

Antenna Options
Integrated or External via SMT Pad
BLE Connections
Yes
Bluetooth Version
5.0
BT Class
1
BT Connections
7
Certifications
FCC, IC, CE, RCM, Giteki, KC, SIG
Chipset
Cypress CYW20704 A2
Dimension (Height - mm)
2.2 mm
Dimension (Length - mm)
8.5 mm
Dimension (Width - mm)
13 mm
Dual Mode
Yes
Logical Interfaces
USB (v2.0), GPIO, GCI, I2S, PCM
NFC
Yes
Processor On Board
No
Receive Sensitivity
-94dBm
Stack On Board
No
Temperature Range
-30°C to +85°C
Transmit Power
8 dBM
Wi-Fi Coexistence
Yes
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Antenna Options Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm) Type
BT850-SA Embedded Module Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 Internal GPIO, GCI, I2S, PCM, USB 2402 MHz 2480 MHz Internal Multilayer Ceramic 2.2 mm 8.5 mm 12 mm Module
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Antenna Options Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm) Type
BT850-ST Embedded Module Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 External GPIO, GCI, I2S, PCM, USB 2402 MHz 2480 MHz External SMT Pad 1.9 mm 8.5 mm 13 mm Module
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm) Type
BT851 USB Adapter Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 Internal GPIO, GCI, I2S, PCM, USB 2402 MHz 2480 MHz 11 mm 43 mm 16 mm USB Pluggable
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Type
DVK-BT-850-SA Development Kit Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 Internal GPIO, GCI, I2S, PCM, USB 2402 MHz 2480 MHz Development Kit
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Type
DVK-BT-850-ST Development Kit Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 External GPIO, GCI, I2S, PCM, USB 2402 MHz 2480 MHz Development Kit

Photo Gallery

BT850-SA

BT850-ST

BT851

Certified Antennas

  • mFlexPIFA Antenna

    001-0030

    mFlexPIFA Flexible Adhesive-Backed PIFA Internal Antenna

    FlexPIFA antenna for metal mounting with minimal detuning. 2.4 GHz and dual-band 2.4/5.5 GHz with 2 dBi of gain. 

    Learn More
  • FlexPIFA Antenna

    001-0014

    FlexPIFA Flexible Adhesive-Backed PIFA Internal Antenna

    FlexPIFA antenna with U.FL connector

    Industry-first, flexible, planar inverted-F antenna for curved surfaces 2.5-3 dBi gain. 2.4 GHz and dual-band 2.4/5.5 GHz. 

    Learn More
  • Nano Blue Series - Bluetooth Internal

    MAF94045

    Nano Blue Series Bluetooth Internal Antenna

    2.4 GHz planar antenna with 2 dBi of Gain and an integrated ground plane for ease of integration.

    Learn More

Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Documentation

Name Part Type Last Updated
Product Brief - BT850 Series v1.4 All Brochure 03/10/2019
BT85x Datasheet All Datasheet 09/03/2020
Application Note - Guidelines for Replacing Antennas v1.0 All Application Note 01/17/2019
BT8x0 PCB RF Design v1 0.pdf All Application Note 01/17/2019
Using the BT85x with Linux and Windows v1 0.pdf All Application Note 01/17/2019
UART HCI Bluetooth Module for Linux v1 0.pdf All Application Note 01/17/2019
HCI Bluetooth Module SPP Connection on Linux v1 0.pdf All Application Note 01/17/2019
RoHSII - EU WEEE Compliance BT RAMP v1 8 All Certification 07/12/2019
BT8x0-SA 3D Models.zip All Documentation 01/17/2019
BT8x0-ST 3D Models.zip All Documentation 01/17/2019
PCN 10B-2018 All Documentation 05/20/2019
BT850-BT860 FCC Certifications All Certification 06/05/2019
BT850-BT860 IC Certifications All Certification 06/05/2019
BT850/BT860 - CE Certifications - 2020 All Certification 09/04/2020
BT850-BT860 MIC Certifications All Certification 06/05/2019
BT850-BT860 KC Certifications All Certification 06/05/2019
BT850-BT860 AS-NZS Certifications All Certification 06/05/2019
BT851 AS-NZS Certifications All Certification 09/20/2019
BT851 EMC Certifications All Certification 09/20/2019
BT851 CE Certifications - 2020 All Certification 08/18/2020
BT851 IC Certifications All Certification 09/20/2019
DVK-BT850-Sx SCH-1.0.pdf DVK-BT-850-SA Documentation 01/17/2019
DVK-BT85x Datasheet v1.1.pdf DVK-BT-850-SA Datasheet 01/29/2020
DVK-BT850-Sx SCH-1.0.pdf DVK-BT-850-ST Documentation 01/17/2019
DVK-BT85x Datasheet v1.1.pdf DVK-BT-850-ST Datasheet 01/29/2020

FAQ

Does the BT851 have the Bluetooth stack on board?

The BT851 is an HCI device and does not have the Bluetooth stack on board, and as such it relies on the host's stack. The BT851 should be recognized by the operating system as a Generic Bluetooth Adapter, not as a COM port.

Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. 

  • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
  • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
  • Ultrasonic cleaning could damage the module permanently.

However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.