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Laird Connectivity Expands System-On-Module Portfolio with Boundary Devices Acquisition
Bringing together embedded electronics leadership and global wireless expertise to create the next generation SOM partner.
Bringing together embedded electronics leadership and global wireless expertise to create the next generation SOM partner.
Akron, Ohio – June 29, 2022 – Laird Connectivity, a global leader in wireless technology, today announced the launch of the newest addition to their system-on-module (SOM) portfolio, the ...
Customers can combine industry-leading hardware with multiple layers of security software and enterprise connectivity, all from a single partner. Akron, Ohio , May 26, 2022 – Global technology...
New Lyra Series of Bluetooth LE Modules Based on Silicon Labs SoC Is Major Addition to Laird Connectivity’s Industry-Leading Portfolio of Bluetooth Solutions Akron, Ohio – 15 February 2022 –...
Akron, Ohio , 27 January 2022 – Global technology leader, Laird Connectivity, has launched the Sterling™-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
Akron, Ohio – December 8, 2021 – Next-generation Wi-Fi 6E provides a foundation for faster, better-performing, lower latency wireless networks at a time when the demands on Wi-Fi networks are...
Akron, Ohio , December 7, 2021 – Global technology leader Laird Connectivity has launched the Sentrius™ BT610 I/O Sensor . Built on Laird Connectivity’s expertise in developing long-range...
Akron, Ohio – November 23, 2021 – Laird Connectivity, a global leader in wireless technology, today announced a partnership with Packetcraft, a Bluetooth® Low Energy (LE) protocol stack...
Akron, Ohio – November 2, 2021 – Laird Connectivity, a global leader in wireless technology, today announced the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M...
Akron, Ohio , October 26, 2021 – Global technology leader, Laird Connectivity, has announced the upcoming Sterling-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
Akron, Ohio , September 23, 2021 – Global technology leader, Laird Connectivity, has launched the Sterling-LWB5+ USB Adapter. Based on the Infineon CYW4373E chipset, the Sterling-LWB5+ packaged...
SCHAFFHAUSEN, Switzerland – September 8, 2021 – TE Connectivity (TE), a world leader in connectivity and sensors, and Laird Connectivity, a leading provider of wireless modules, IoT devices, and...