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Laird Connectivity Expands System-On-Module Portfolio with Boundary Devices Acquisition
Bringing together embedded electronics leadership and global wireless expertise to create the next generation SOM partner.
Newsroom
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Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth
Akron, Ohio – June 29, 2022 – Laird Connectivity, a global leader in wireless technology, today announced the launch of the newest addition to their system-on-module (SOM) portfolio, the ...
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Laird Connectivity Announces Summit Suite, a Customizable Security Portfolio that Simplifies the Process of Protecting Devices
Customers can combine industry-leading hardware with multiple layers of security software and enterprise connectivity, all from a single partner. Akron, Ohio , May 26, 2022 – Global technology...
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Laird Connectivity, in Partnership with Silicon Labs, Launches Advanced Bluetooth LE Module Series that Accelerates IoT Development
New Lyra Series of Bluetooth LE Modules Based on Silicon Labs SoC Is Major Addition to Laird Connectivity’s Industry-Leading Portfolio of Bluetooth Solutions Akron, Ohio – 15 February 2022 –...
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Laird Connectivity Launches Sterling™-LWB+ Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , 27 January 2022 – Global technology leader, Laird Connectivity, has launched the Sterling™-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
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Laird Connectivity Simplifies the Future of Wi-Fi Design with Industry-Leading Family of Wi-Fi 6E Antenna Solutions
Akron, Ohio – December 8, 2021 – Next-generation Wi-Fi 6E provides a foundation for faster, better-performing, lower latency wireless networks at a time when the demands on Wi-Fi networks are...
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New Long-Range Bluetooth I/O Sensor from Laird Connectivity Enables Cloud Based Monitoring in the Harshest IoT Environments
Akron, Ohio , December 7, 2021 – Global technology leader Laird Connectivity has launched the Sentrius™ BT610 I/O Sensor . Built on Laird Connectivity’s expertise in developing long-range...
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Laird Connectivity and Packetcraft Partner to Deliver Advanced LE Audio Evaluation Kits
Akron, Ohio – November 23, 2021 – Laird Connectivity, a global leader in wireless technology, today announced a partnership with Packetcraft, a Bluetooth® Low Energy (LE) protocol stack...
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New System-on-Module from Laird Connectivity Delivers Powerful NXP Edge Processing with NXP Wi-Fi and Bluetooth
Akron, Ohio – November 2, 2021 – Laird Connectivity, a global leader in wireless technology, today announced the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M...
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Laird Connectivity Announces Fully Featured Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , October 26, 2021 – Global technology leader, Laird Connectivity, has announced the upcoming Sterling-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
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Laird Connectivity Launches Wi-Fi 5 USB Adapter for Embedded Devices
Akron, Ohio , September 23, 2021 – Global technology leader, Laird Connectivity, has launched the Sterling-LWB5+ USB Adapter. Based on the Infineon CYW4373E chipset, the Sterling-LWB5+ packaged...
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TE Connectivity to Acquire Antenna Business from Laird Connectivity
SCHAFFHAUSEN, Switzerland – September 8, 2021 – TE Connectivity (TE), a world leader in connectivity and sensors, and Laird Connectivity, a leading provider of wireless modules, IoT devices, and...