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Laird Connectivity Extends Global Partnership with Silicon Labs Announcing the Lyra 24 Series
Next Generation Bluetooth LE for Advanced IoT Device Development
Newsroom
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Laird Connectivity Brings Device Management Capabilities to Their Portfolio of IoT Devices with Canvas™ Device Manager
Easily Streamline Device Ecosystems and Automate Data Provisioning to Deployed IoT Devices
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Laird Connectivity Announces the RM126x Ultra-Low Power LoRaWAN® Module Series
Delivering Exceptional Range with Minimal Power Consumption for Challenging RF Use Cases
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Nitrogen8M Plus SMARC® System-On-Module Combining Powerful NXP Edge Processing with Wi-Fi 5 and Bluetooth 5.2 Connectivity
Akron, Ohio – March 30, 2023 – Laird Connectivity, a global leader in wireless technology and Boundary Devices, leading supplier of NXP’s i.MX based SOMs, announce the Nitrogen8M Plus in a...
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Laird Connectivity Announces the BL5340PA Bluetooth 5.2 Module for Multi-Core, Multi-Protocol Long Range Bluetooth Connectivity
Akron, Ohio – 22 February 2023 – Laird Connectivity, a global leader in wireless technology, today announces the BL5340PA (Power Amplified) Bluetooth module series, their most advanced, secure,...
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Laird Connectivity Delivers Eight New Sub-GHz, Peel-and-Stick PIFA Antennas Including Standard and Inverted Mounting Options
Akron, Ohio – 14 February 2022 – Laird Connectivity, announces new additions to their internal antennas portfolio with support for 868MHz and 915MHz frequency bands in the FlexPIFA (Planar...
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Laird Connectivity Expands System-On-Module Portfolio with Boundary Devices Acquisition
Bringing together embedded electronics leadership and global wireless expertise to create the next generation SOM partner.
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Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth
Akron, Ohio – June 29, 2022 – Laird Connectivity, a global leader in wireless technology, today announced the launch of the newest addition to their system-on-module (SOM) portfolio, the ...
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Laird Connectivity Announces Summit Suite, a Customizable Security Portfolio that Simplifies the Process of Protecting Devices
Customers can combine industry-leading hardware with multiple layers of security software and enterprise connectivity, all from a single partner. Akron, Ohio , May 26, 2022 – Global technology...
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Laird Connectivity, in Partnership with Silicon Labs, Launches Advanced Bluetooth LE Module Series that Accelerates IoT Development
New Lyra Series of Bluetooth LE Modules Based on Silicon Labs SoC Is Major Addition to Laird Connectivity’s Industry-Leading Portfolio of Bluetooth Solutions Akron, Ohio – 15 February 2022 –...
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Laird Connectivity Launches Sterling™-LWB+ Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , 27 January 2022 – Global technology leader, Laird Connectivity, has launched the Sterling™-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
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Laird Connectivity Simplifies the Future of Wi-Fi Design with Industry-Leading Family of Wi-Fi 6E Antenna Solutions
Akron, Ohio – December 8, 2021 – Next-generation Wi-Fi 6E provides a foundation for faster, better-performing, lower latency wireless networks at a time when the demands on Wi-Fi networks are...