BT860 Series Bluetooth Module
Overview
The BT86x series of UART HCI modules leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low Energy support. The Bluetooth 5 core specification shortens your development time and provides enhanced throughput, security and privacy.
The BT860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and Cypress' GCI coexistence(2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.
These modules present a Bluetooth standard HCI interface with support for Linux / Android and Embedded Bluetooth software stacks for operating system backed devices. Additionally, Laird has partnered with SEARAN for support of their ultra small, flexible ‘dotstack’ platform for embedded Cortex M3 and M4 implementations.
- Bluetooth v5.0 – Dual Mode – BR / EDR / LE – Classic Bluetooth and Bluetooth Low Energy (BLE)
- Compact Footprint – As small as 8.5 x 12.85 mm
- Class 1 Output – up to 8 dBm
- UART Host interface
- GPIO, GCI, I2S and PCM
- Industrial Operating Temp: -30° to +85°C
- Bluetooth SIG approved – Hardware Controller Subsystem
- International regulatory approvals – FCC, IC, CE, RCM, Korea, and Japan approvals
- Broad BT Stack Support – Linux, Android, Embedded
- Fully-Featured Development Kit – Low cost kit for prototyping/debugging/integration testing to speed development time
Use the BT860 with SEARAN's Dotstack
Learn how to connect SEARAN's STM32F discovery board to drive Laird's BT860 BLE module, create a Bluetooth A2DP connection to your tablet and run a throughput test.
Specifications
| Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Antenna Options | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BT860-SA | Embedded Module | Blutooth 5.0, Dual Mode (Classic + BLE) | HCI, Linux, Windows, Android | Hosted | Infineon (Cypress) CYW20704 A2 | Internal | GPIO, GCI, I2S, PCM, Serial | 2402 MHz | 2480 MHz | Internal Multilayer Ceramic | 2.2 mm | 12.85 mm | 8.5 mm |
| Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Antenna Options | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BT860-ST | Embedded Module | Blutooth 5.0, Dual Mode (Classic + BLE) | HCI, Linux, Windows, Android | Hosted | Infineon (Cypress) CYW20704 A2 | External | GPIO, GCI, I2S, PCM, Serial | 2402 MHz | 2480 MHz | External SMT Pad | 1.9 mm | 12.85 mm | 8.5 mm |
| Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Type | |
|---|---|---|---|---|---|---|---|---|---|---|
| DVK-BT860-SA | Development Kit | Blutooth 5.0, Dual Mode (Classic + BLE) | HCI, Linux, Windows, Android | Hosted | Infineon (Cypress) CYW20704 A2 | Internal | GPIO, GCI, I2S, PCM, Serial | 2402 MHz | 2480 MHz | Development Kit |
| Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Type | |
|---|---|---|---|---|---|---|---|---|---|---|
| DVK-BT860-ST | Development Kit | Blutooth 5.0, Dual Mode (Classic + BLE) | HCI, Linux, Windows, Android | Hosted | Infineon (Cypress) CYW20704 A2 | External | GPIO, GCI, I2S, PCM, Serial | 2402 MHz | 2480 MHz | Development Kit |
Photo Gallery
BT860-SA
BT860-ST
Certified Antennas
001-0030
mFlexPIFA Flexible Adhesive-Backed PIFA Internal AntennaFlexPIFA antenna for metal mounting with minimal detuning. 2.4 GHz and dual-band 2.4/5.5 GHz with 2 dBi of gain.
001-0014
FlexPIFA Flexible Adhesive-Backed PIFA Internal AntennaFlexPIFA antenna with U.FL connector
Industry-first, flexible, planar inverted-F antenna for curved surfaces 2.5-3 dBi gain. 2.4 GHz and dual-band 2.4/5.5 GHz.
MAF94045
NanoBlue Series Bluetooth Internal Antenna2.4 GHz planar antenna with 2 dBi of Gain and an integrated ground plane for ease of integration.
Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team
- Antenna Scans
- Antenna selection and placement
- Custom antenna design
- Worldwide EMC testing / certifications
- Embedded RF hardware / firmware design
- Cloud architecture and integration
- Mobile application development
- Product & Industrial Design
Documentation
| Name | Part | Type | Last Updated |
|---|---|---|---|
| Product Brief - BT860 Series | All | Brochure | 10/30/2020 |
| Datasheet - BT860 | All | Datasheet | 02/05/2021 |
| UART HCI Bluetooth Module for Linux v1 0.pdf | All | Application Note | 01/17/2019 |
| HCI Bluetooth Module SPP Connection on Linux v1 0.pdf | All | Application Note | 01/17/2019 |
| BT8x0 PCB RF Design v1 0.pdf | All | Application Note | 01/17/2019 |
| RoHS 3 - Bluetooth | All | Certification | 11/10/2020 |
| 3D Models - BT8x0-SA | All | Documentation | 11/03/2020 |
| 3D Models - BT8x0-ST | All | Documentation | 11/03/2020 |
| Application Note - Guidelines for Replacing Antennas v1.0 | All | Application Note | 01/17/2019 |
| PCN 10B-2018 | All | Documentation | 05/20/2019 |
| BT850-BT860 AS-NZS Certifications | All | Certification | 06/06/2019 |
| BT850/BT860 - CE Certifications - 2020 | All | Certification | 09/04/2020 |
| BT850-BT860 FCC Certifications | All | Certification | 06/06/2019 |
| BT850-BT860 IC Certifications | All | Certification | 06/06/2019 |
| BT850-BT860 KC Certifications | All | Certification | 06/06/2019 |
| BT850-BT860 MIC Certifications | All | Certification | 06/06/2019 |
| DVK-BT860 Datasheet v1 0.pdf | DVK-BT860-SA | Datasheet | 03/01/2019 |
| DVK-BT860-Sx SCH-1.0.pdf | DVK-BT860-SA | Documentation | 01/17/2019 |
| DVK-BT860 Datasheet v1 0.pdf | DVK-BT860-ST | Datasheet | 03/01/2019 |
| DVK-BT860-Sx SCH-1.0.pdf | DVK-BT860-ST | Documentation | 01/17/2019 |
How can I connect a Bluetooth Low Energy Device to a PC?
Bluetooth Low Energy uses Services as opposed to the set of standardized profiles that exists for Classic Bluetooth. While some Bluetooth Low Energy services have been standardized by the Bluetooth SIG, the development of custom services is allowed to meet custom application requirements.
Because Bluetooth Low Energy uses a completely different protocol than Classic Bluetooth and supports custom services, Bluetooth Low Energy devices cannot connect to a computer through the typical Bluetooth configuration of a computer. Therefore, connecting to a PC requires writing and running a Bluetooth Low Energy Central Role/Client application to collect the data sent from the Bluetooth Low Energy peripheral modules. Application development for PCs and Mobile devices is outside the scope of our support. Alternatively, a BL654 USB dongle could be used as a BLE Central Role device, to collect the BLE data and pass it to the PC over a COM Port. However, you would still need an application to view and process the data received over that COM Port.
We generally recommend customers who are new to Bluetooth Low Energy obtain a copy of Getting Started with Bluetooth Low Energy to help them understand the Bluetooth Low Energy protocol and the GATT table. There are also many resources available online which explain this.
When Bluetooth Low Energy was first introduced and we launched our BL6xx product line (predecessors to the BL65x series) we produced the BL600 and BL620 smartBASIC Application Walkthrough document, which provides an overview of how Bluetooth Low Energy works and how a GATT table is constructed.
Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.
- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
- Ultrasonic cleaning could damage the module permanently.
However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.