BT860 Series Bluetooth Module

Recommended for New Design (RND)

Overview

The BT86x series of UART HCI modules leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low Energy support. The Bluetooth 5 core specification shortens your development time and provides enhanced throughput, security and privacy. 

The BT860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and Cypress' GCI coexistence(2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. 

These modules present a Bluetooth standard HCI interface with support for Linux / Android and Embedded Bluetooth software stacks for operating system backed devices. Additionally, Laird has partnered with SEARAN for support of their ultra small, flexible ‘dotstack’ platform for embedded Cortex M3 and M4 implementations. 

  • Bluetooth v5.0 – Dual Mode – BR / EDR / LE – Classic Bluetooth and Bluetooth Low Energy (BLE)
  • Compact Footprint – As small as 8.5 x 12.85 mm
  • Class 1 Output – up to 8 dBm
  • UART Host interface
  • GPIO, GCI, I2S and PCM
  • Industrial Operating Temp: -30° to +85°C
  • Bluetooth SIG approved – Hardware Controller Subsystem
  • International regulatory approvals – FCC, IC, CE, RCM, Korea, and Japan approvals
  • Broad BT Stack Support – Linux, Android, Embedded
  • Fully-Featured Development Kit – Low cost kit for prototyping/debugging/integration testing to speed development time 

Use the BT860 with SEARAN's Dotstack

Learn how to connect SEARAN's STM32F discovery board to drive Laird's BT860 BLE module, create a Bluetooth A2DP connection to your tablet and run a throughput test.

WATCH VIDEO

Searan Dotstack and the Laird Connectivity BT860 Development Board

Specifications

Antenna Options
Integrated or External via Trace Pad
BLE Connections
Yes
Bluetooth Version
5.0
BT Class
1
Central Role
Yes
Certifications
FCC, IC, CE, RMC, KC Giteki, SIG
Chipset
Cypress CYW20704 A2
Dual Mode
Yes
Logical Interfaces
UART, GPIO, I2S and PCM
Operating Temp - Max (°C)
85 °C
Operating Temp - Min (°C)
-30 °C
Peripheral Role
Yes
Processor On Board
No
Receive Sensitivity
-94dBm
Stack On Board
No
Transmit Power
8 dBM
Wi-Fi Coexistence
2-wire Cypress Global Coexistence Interface (GCI)
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Antenna Options Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm)
BT860-SA Embedded Module Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 Internal GPIO, GCI, I2S, PCM, Serial 2402 MHz 2480 MHz Internal Multilayer Ceramic 2.2 mm 12.85 mm 8.5 mm
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Antenna Options Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm)
BT860-ST Embedded Module Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 External GPIO, GCI, I2S, PCM, Serial 2402 MHz 2480 MHz External SMT Pad 1.9 mm 12.85 mm 8.5 mm
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Type
DVK-BT860-SA Development Kit Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 Internal GPIO, GCI, I2S, PCM, Serial 2402 MHz 2480 MHz Development Kit
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Type
DVK-BT860-ST Development Kit Blutooth 5.0, Dual Mode (Classic + BLE) HCI, Linux, Windows, Android Hosted Infineon (Cypress) CYW20704 A2 External GPIO, GCI, I2S, PCM, Serial 2402 MHz 2480 MHz Development Kit

Photo Gallery

BT860-SA

BT860-ST

Certified Antennas

  • mFlexPIFA Antenna

    001-0030

    mFlexPIFA Flexible Adhesive-Backed PIFA Internal Antenna

    FlexPIFA antenna for metal mounting with minimal detuning. 2.4 GHz and dual-band 2.4/5.5 GHz with 2 dBi of gain. 

    Learn More
  • FlexPIFA Antenna

    001-0014

    FlexPIFA Flexible Adhesive-Backed PIFA Internal Antenna

    FlexPIFA antenna with U.FL connector

    Industry-first, flexible, planar inverted-F antenna for curved surfaces 2.5-3 dBi gain. 2.4 GHz and dual-band 2.4/5.5 GHz. 

    Learn More
  • Nano Blue Series - Bluetooth Internal

    MAF94045

    Nano Blue Series Bluetooth Internal Antenna

    2.4 GHz planar antenna with 2 dBi of Gain and an integrated ground plane for ease of integration.

    Learn More

Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Documentation

Name Part Type Last Updated
Product Brief - BT860 Series All Brochure 10/30/2020
Datasheet - BT860 All Datasheet 10/13/2020
UART HCI Bluetooth Module for Linux v1 0.pdf All Application Note 01/17/2019
HCI Bluetooth Module SPP Connection on Linux v1 0.pdf All Application Note 01/17/2019
BT8x0 PCB RF Design v1 0.pdf All Application Note 01/17/2019
RoHSII - EU WEEE Compliance BT RAMP v1 8 All Certification 07/12/2019
BT8x0-SA 3D Models.zip All Documentation 01/17/2019
BT8x0-ST 3D Models.zip All Documentation 01/17/2019
Application Note - Guidelines for Replacing Antennas v1.0 All Application Note 01/17/2019
PCN 10B-2018 All Documentation 05/20/2019
BT850-BT860 AS-NZS Certifications All Certification 06/06/2019
BT850/BT860 - CE Certifications - 2020 All Certification 09/04/2020
BT850-BT860 FCC Certifications All Certification 06/06/2019
BT850-BT860 IC Certifications All Certification 06/06/2019
BT850-BT860 KC Certifications All Certification 06/06/2019
BT850-BT860 MIC Certifications All Certification 06/06/2019
DVK-BT860 Datasheet v1 0.pdf DVK-BT860-SA Datasheet 03/01/2019
DVK-BT860-Sx SCH-1.0.pdf DVK-BT860-SA Documentation 01/17/2019
DVK-BT860 Datasheet v1 0.pdf DVK-BT860-ST Datasheet 03/01/2019
DVK-BT860-Sx SCH-1.0.pdf DVK-BT860-ST Documentation 01/17/2019

FAQ

Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. 

  • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
  • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
  • Ultrasonic cleaning could damage the module permanently.

However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.