BT860 Series Bluetooth Module

Bluetooth Low Energy uses Services as opposed to the set of standardized profiles that exists for Classic Bluetooth. While some Bluetooth Low Energy services have been standardized by the Bluetooth SIG, the development of custom services is allowed to meet custom application requirements.
 
Because Bluetooth Low Energy uses a completely different protocol than Classic Bluetooth and supports custom services, Bluetooth Low Energy devices cannot connect to a computer through the typical Bluetooth configuration of a computer. Therefore, connecting to a PC requires writing and running a Bluetooth Low Energy Central Role/Client application to collect the data sent from the Bluetooth Low Energy peripheral modules. Application development for PCs and Mobile devices is outside the scope of our support. Alternatively, a BL654 USB dongle could be used as a BLE Central Role device, to collect the BLE data and pass it to the PC over a COM Port. However, you would still need an application to view and process the data received over that COM Port.
 
We generally recommend customers who are new to Bluetooth Low Energy obtain a copy of Getting Started with Bluetooth Low Energy to help them understand the Bluetooth Low Energy protocol and the GATT table. There are also many resources available online which explain this. 

When Bluetooth Low Energy was first introduced and we launched our BL6xx product line (predecessors to the BL65x series) we produced the BL600 and BL620 smartBASIC Application Walkthrough document, which provides an overview of how Bluetooth Low Energy works and how a GATT table is constructed. 

Yes, the following modules share the same pin layout:

BT800 --> BT850
BT830 --> BT860

There are some No Connect (NC) pins on the BT850/860

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. 

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.

However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.