Summit SOM 8M Plus System-on-Module - WiFi 5 + Bluetooth 5.3

Under Development

Overview

Our customers asked for a high-performance, secure, and robust IoT SoM that’s rugged, simplifies their BOM, has reliable connectivity, and is globally certified. One with a proven security architecture, long term software support, security fixes, and device management.

Our new Summit SOM 8M Plus is powered by NXP’s innovative i.MX 8M Plus processor and 88W8997 wireless silicon coupled with onboard NXP PMICs (PCA9450CHN and PM823UK), performance LPDDR4 RAM, and eMMC 5.1 storage. We combine this with our long-term support Summit Yocto Linux, secure enclave, and Summit Linux FIPS Core Crypto to offer a comprehensive hardware and software solution throughout your product’s lifecycle.

  • Advanced DVK with reference designs for display, camera, audio, LTE, GPS, power consumption profiling, PoE, battery usage, battery charging, USB 3.0 power, and a Bluetooth 5.3 module integration supporting LE coded/Long Range
  • Secure Enclave for secure boot, secure credential, and secure data storage including Secure Manufacturing and Provisioning
  • Security and Software Life Cycle Maintenance: Support for Summit Yocto Linux with CVE notification and remediation on long term support versions that minimize the impact of changes and revisions
  • FIPS 140-3 Level 1 validation managed over the life of product​

Laird Connectivity is an NXP Gold Partner

Laird Connectivity is honored to be approved as an NXP Gold Partner! We look forward to working with the NXP team to deliver the solutions our customers need in an ever changing wireless future. Please follow the link for more information.

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NXP Gold Partner

Sign up to Win a Summit SOM 8M Plus DVK!

Our development kits include reference designs for display, camera, audio, LTE, GPS, power consumption profiling, PoE, battery usage, battery charging, USB 3.0 power, and a Bluetooth 5.2 module integration supporting LE coded/Long Range.

Register for a chance to win a free development kit! 

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Summit SOM 8M

Specifications

Chipset (MPU)
4x Cortex®-A53 cores @ 1.6 GHz
(NXP I.MX 8M Plus)
Chipset (MCU)
1x Cortex®-M7 core @ 800 MHz
(NXP I.MX 8M Plus)
Wireless Specification
Wi-Fi 5 (802.11ac)
Bluetooth 5.3
Chipset (Wireless)
NXP 88W8997
Dimensions
40 x 47 x 4.6 mm
Antenna Options
2x U.FL connector
Chipset (Audio)
Tensilica® HiFi 4 DSP
Chipset (Graphics)
GC7000UL with 2 shaders for 3D and GC520L for 2D
Chipset (Machine Learning)
Neural Processing Unit (NPU) with 2.3 TOP/s
Frequency
Dual-band 2.4 GHz and 5 GHz
GPU Features
166 million triangles/sec
1.0 giga pixel/sec
16 GFLOPs 32-bit
OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan
2D acceleration
Interfaces - Audio
SPDIF input and output
Six external SAI modules supporting I2S, AC97, TDM, codec/DSP, and DSD interfaces
ASRC
eARC/ARC (HDMI)
8-channel PDM mic input
Interfaces - General
2x USB 3.0/2.0 Dual-Role with PHY
2x Gbit Ethernet with IEEE® 1588, AVB (One also supports TSN)
2x CAN/CAN FD
4x UART 5 Mbit/s
6x I2C
3x SPI
1x SDIO 3.0/eMMC 5.1
Interfaces - Video
Video Decode: 1080p60 HEVC/H.265 Main, Main 10 (up to level 5.1), 1080p60 VP9 Profile 0, 2, 1080p60 VP8, 1080p60 AVC/H.264 Baseline, Main, High decoder
Video Encode: 1080p60 AVC/H.264 encoder, 1080p60 HEVC/H.265 encoder
Machine Learning Features
Keyword detect, noise reduction, beamforming
Speech recognition (i.e. Deep Speech 2)
Image recognition (i.e. ResNet-50)
Memory
Up to 2GB LPDDR4 standard
Up to 6GB LPDDR4 on request
Temperature Range
-30° C to +85° C
Transmit Power (Max)
+18 dBm
Description
453-00070 Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC)
Description
453-00070-K1 Development Kit for Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC)
Description
453-00071 Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC)
Description
453-00071-K1 Development Kit for Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC)
Description
453-00072 Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC)
Description
453-00072-K1 Development Kit for Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC)

Certified Antennas

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    CAF94505

    Nanoblade Series Internal Antenna

    Vertically polarized, omnidirectional planar antenna with 2 dBi gain @2.24-2.5 GHz, 3.9 dBi gain @ 5.15-5.35 GHz, and 4 dBi gain @ 5.6 Ghz. 

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  • EMF2471A3S

    MAF95310

    Mini NanoBlade Flex / Flex 6E Series Internal Antenna

    Flexible, onmidirectional PCB Mini NanoBlade. Vertically polarized, with 2.79 dBi gain @ 2.4 GHz, 3.38 dBi gain @ 5 GHz, and 5.2 dBi gain @ 6GHz. 

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  • FlexMIMO Dual-Band MIMO Antenna

    EFD2455A3S-10MHF1

    FlexMIMO Dual-Band MIMO Internal Antenna

    The world's first flexible PIFA antenna for Wi-Fi MIMO applications with gain of 2-3.5 dBi. 

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  • FlexPIFA and FlexPIFA 6E

    001-0016

    FlexPIFA / FlexPIFA 6E Flexible Adhesive-Backed PIFA Internal Antennas

    Industry-first, flexible, planar inverted-F antennas for curved surfaces.

    2.5-3 dBi gain.

    Available in 2.4 GHz, dual-band 2.4/5 GHz and Wi-Fi 6E 2.4/5/6 GHz.

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Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Documentation

Name Part Type Last Updated
Product Brief - Summit SOM 8M Plus (PRELIMINARY) All Product Brief 11/01/2021