Laird Connectivity is now EzurioSona™ IF513 - WiFi 6E + Bluetooth® 5.4 Module
Under Development: Preview
Overview
Introducing the newest member of the Sona™ Wi-Fi 6/6E product line from Ezurio (formerly Laird Connectivity), the IF513, based upon Infineon’s leading AIROC™ CYW55513 chipset. A truly robust industrial IoT module: one that’s rugged, small, globally certified, has reliable connectivity, and is easy to integrate.
Our new Sona™ IF513 answers the call for next-gen wireless IoT. The Sona™ IF513 is purpose-built for industrial IoT connectivity with access to a SDIO interface, industrial operating temp range, latest generation Wi-Fi and BT combined with both pluggable card and SMT M.2 packaging.
When matched with our industry leading services and support, the Sona IF513 is the only Wi-Fi module of its kind, addressing all your Wi-Fi 6E needs.
- Compatible: Our Linux Backports package supports many Linux kernels including v6.1.x.
- Reliable: Integrated PA (Power Amplifier) and LNA (Low Noise Amplifier) with 1x1 MU-SISO antenna for reliable connectivity in harsh RF environments.
- Robust: Rich feature-set including 802.11ax Wi-Fi 6E and Dual-Mode BT v5.4. Support for the 6GHz spectrum. Reliable industrial temperature range, and solder-down module is suitable for industrial rugged applications.
- Secure: Supports the latest WPA2/3 personal and Enterprise security standards.
Premium WiFi Advantage
The road to bringing wireless to your product is perilous and long – but it doesn’t have to be. These are the pillars of our value as a partner and provider: Excellence in development across hardware and software, delivered with industry-best support and deployed around the world in the markets that drive your business success.
Specifications
Wireless Specification
Wi-Fi 6E (802.11 a/b/g/n/ac/ax) Bluetooth v5.4 (BDR + EDR + BLE)
Frequency
2.4, 5, and 6 GHz (up to 7.125 GHz)
Chipset
Infineon AIROC™ CYW55513
Antenna Options
RF Antenna Pin (Up to 2x) / Onboard MHF4 Connector (Up to 2x)
Certifications
FCC/IC/CE/MIC/RCM/Bluetooth SIG
Data Rate
2.4 GHz: Up to 574 Mbps, 1024-QAM, 1x1 SISO
5 GHz/6 GHz: Up to 1.2 Gbps, 1024-QAM, 1x1 SISO
5 GHz/6 GHz: Up to 1.2 Gbps, 1024-QAM, 1x1 SISO
Form Factor
M.2 1216 (SMT)
M2. 2230 E-Key (Pluggable)
M2. 2230 E-Key (Pluggable)
Interfaces - General
SDIO 3.0 (Wi-Fi) and HCI using HS-UART (BT)
Operating Temp (Max) (°C)
+85 °C
Operating Temp (Min) (°C)
-40 °C
| Part Number | Antenna Type | Bulk or Single | Chipset (Wireless) | Form Factor | Frequency | Interfaces - General | Packaging | Product Type | System Architecture | Technology |
|---|---|---|---|---|---|---|---|---|---|---|
 Under Development: Preview | 1x MHF4L Connector | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Tape and Reel | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
Under Development: Preview | 1x MHF4L Connector | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Cut Tape | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
 Under Development: Preview | 1x Trace Pin | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Tape and Reel | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
Under Development: Preview | 1x Trace Pin | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Cut Tape | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
 Under Development: Preview | 2x MHF4L Connector (Antenna Diversity) | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Tape and Reel | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
Under Development: Preview | 2x MHF4L Connector (Antenna Diversity) | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Cut Tape | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
 Under Development: Preview | 2x Trace Pin (Antenna Diversity) | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Tape and Reel | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
Under Development: Preview | 2x Trace Pin (Antenna Diversity) | Bulk | Infineon CYW55513 | M.2 1216 (SMT) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Cut Tape | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
 Under Development: Preview | 1x MHF4L Connector | Single | Infineon CYW55513 | M.2 2230 E-Key (Pluggable) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 | |
 Under Development: Preview | 2x MHF4L Connector (Antenna Diversity) | Single | Infineon CYW55513 | M.2 2230 E-Key (Pluggable) | 2.4 / 5 / 6 GHz | SDIO 3.0 (Wi-Fi), HCI using HS-UART (BT) | Embedded Module | Hosted | Wi-Fi 6E, Bluetooth 5.4 |
Documentation
| Name | Part | Type | Last Updated |
|---|---|---|---|
| Product Brief - Sona IF513 Series | All | Product Brief | 04/25/2024 |
| Integration Guide - Sona IF513 Series (PRELIMINARY) | All | Documentation | 02/06/2024 |
How to activate SDIO on the M2 slot of the i.MX8 LPDDR4 DVK of NXP
After building a default image for the NXP i.MX8 LPDDR4 DVK device tree is such that M2 slot provides PCIe connectivity.
However SDIO device tree is generated and available in the image.
The parameter "fdtfile=" in U-Boot needs to be changed.
Change "fdtfile=imx8mp-evk-revb4.dtb" to "fdtfile=imx8mp-evk-usdhc1-m2.dtb" by:
u-boot=> setenv fdtfile imx8mp-evk-revb4-usdhc1-m2.dtb
u-boot=> saveenv
Reference:
root@imx8mp-lpddr4-evk:~# ls /dev/mmc*
/dev/mmcblk2 /dev/mmcblk2boot0 /dev/mmcblk2boot1 /dev/mmcblk2p1 /dev/mmcblk2p2 /dev/mmcblk2rpmb
root@imx8mp-lpddr4-evk:~# mount /dev/mmcblk2p1 /media/
root@imx8mp-lpddr4-evk:~# ls /media | grep usdhc
imx8mp-evk-revb4-usdhc1-m2.dtb
imx8mp-evk-usdhc1-m2.dtb
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Distributors
| Distributor | Phone Number | Region | Website |
|---|---|---|---|
| Arrow Electronics | 1-855-326-4757 +44 2039 365486 |
APAC, North America, South America, EMEA | Website |
| Avnet | 1-480-643-2000 +44 1628 512900 |
APAC, North America, South America, EMEA | Website |
| Braemac Australia, New Zealand, South East Asia | +61 2 9550 6600 +64 9 477 2148 |
APAC | Website |
| Cal-Chip Connect | 1-215-942-8900 |
North America | Website |
| DigiKey | 1-800-344-4539 |
North America, South America, APAC, EMEA | Website |
| EBV Elektronik | EMEA | Website | |
| Farlink Technology China, Hong Kong | +86 13266922199 |
APAC | Website |
| Farnell | 1-800-936-198 +44 3447 11 11 22 |
EMEA | Website |
| Future Electronics | 1-800-675-1619 1-514-428-8470 |
North America, South America, APAC, EMEA | Website |
| Glyn | +49-6126-590-0 |
EMEA | Website |
| Hy-Line Germany Only | +49 89 614 503 0 |
EMEA | Website |
| Jetronic China, Hong Kong and Taiwan | 852-27636806 |
APAC | Website |
| Laird Connectivity | 1-847-839-6925 +44 1628 858941 |
North America, South America, APAC, EMEA | Website |
| M2M Germany | +49-6081-587386-0 |
EMEA | Website |
| Martinsson | +46 8 7440300 |
EMEA | Website |
| McCoy South East Asia | +65 6515 2988 |
APAC | Website |
| Mouser | 1-800-346-6873 +44 1494 427500 |
North America, South America, APAC, EMEA | Website |
| RS Components | +852-2421-9898 +44 3457-201201 |
North America, South America, APAC, EMEA | Website |
| Ryoyo Japan | +81-3-3543-7711 |
APAC | Website |
| Solsta UK Only | +44 (0) 1527 830800 |
EMEA | Website |
| Supreme Components International India, South East Asia | +65 6848-1178 |
APAC | Website |
| Symmetry Electronics | 1-866-506-8829 |
North America | Website |
| Tekdis Australia and New Zealand | +61 3 8669 1210 |
APAC | Website |
| Telsys | +972 3 7657666 |
EMEA | Website |
| WPG | +44 1628 958460 |
EMEA | Website |