Sterling™-LWB+ WiFi 4 and Bluetooth 5.2 Modules

Yes as new kernels are updated in Ubuntu automatically it will break backports and will need to be reinstalled.

The AP and STA are on the same channel potentially causing disconnections if the STA roams to a different AP. The Sterling-70 has the advantage of dual independent radios that can run on different Wi-Fi channels.

This can be found by reviewing the release notes for the specific product on GitHub.

• LWB, LWB5, LWB5+ - Sterling-LWB-and-LWB5-Release-Packages
• Sterling 60 - Sterling-60-Release-Packages

Please refer this blog as below. Laird are currently investigating these issues internally and investigating with the chipset vendors and our internal QA team to establish test scenarios to evaluate the impacted devices.

https://www.lairdconnect.com/resources/blog/frag-attack-wi-fi-putting-pieces-back-together

No, if VBAT is 3.6V or greater, this power source should be used for VDDIO_RF, and USB2_AVDD33 if strapped for USB. Otherwise leave this pin disconnected.

MCS stands for Modulation Coding Scheme and is an industry metric index based on Wi-Fi connection parameters between a client and wireless access point. These parameters include modulation type, coding rate, spatial streams, channel width, and guard interval.

Laird modules can be used on a Ubuntu system with a kernel version that is supported by Laird backports.

To check, find the kernel version of the Ubuntu system and then check the release notes of the products to see if the latest backports supports that kernel.

Sterling-60 Release Notes

Sterling-LWB Release Notes

The shelf life statements are essentially to prevent mishandling of the product and not storing it properly. If the modules are still sealed in the package, stored at the proper temperature and have not been exposed to moisture they should be fine. However, when working with modules beyond their shelf life you MUST bake the modules before populating the them to your board. Failure to bake the modules could result in the yield rate dropping down lower than expectation due to popcorn or de-lamination on the modules. It is recommended that you follow IPC/JEDEC J-STD-033 which is the general standard for the handling, packing, shipping and use of moisture/reflow sensitive surface mount devices.

Our main concern is around the castellation/pads which solder the module to the board. It is imperative those pads do not get tarnished, as this would cause soldering issues. Humidity can affect solderability as well, as if there is any excess moisture in the solder on the module, during reflow of the module to the board, steam balls can essentially explode the solder and sometimes result in an open circuit (or possibly a short circuit).

As long as all of the moisture handling and temperature guidelines are being followed you will likely have no issues. It is further recommended that when you do the build with modules that have exceeded their shelf life that you start with a handful to perform a test run and do a final test to make sure all is working as expected. As long as there are no issues with the initial test run we would expect that you will not experience any problems.

(1) By option regdomain

/etc/modprobe.d/brcmfmac.conf

# Sample contents of a brcmfmac.conf file configured for operation in
#  the United States
options brcmfmac regdomain="US"

(2) By device tree

@mmc0 {
  #address-cells = <1>;
  #size-cells = <0>;
  bus-width = <4>;
  non-removable;

  brcmf: wifi@1 {
    reg = <1>;
    compatible = "brcm,bcm4329-fmac";
    laird,regdomain = "US";
  };
};