Sterling™-LWB+ WiFi 4 and Bluetooth 5.2 Modules

Recommended for New Design (RND)

Overview

Laird Connectivity’s new Sterling-LWB+ WiFi 4 with Bluetooth 5.2 module, based upon the Infineon AIROC™ CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This embedded module series is available as a System-in-Package (SIP) and two certified module versions, supporting either an on-board chip antenna or a MHF connector for an external antenna. It is designed to meet the demands of medical and industrial IoT connectivity, and is mechanically and pin compatible with our Sterling-LWB module as an upgrade path for existing customers.

The Sterling-LWB+ contains a fully featured WiFi 4 radio, enabled with our industry-leading software drivers and support. The secure, high performance SDIO solution provides easy integration with any Linux or Android based system. It is designed for IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for wireless IoT applications.

  • Compatible: Our Linux Backports package supports many Linux kernels.
  • Reliable:  High quality drivers and extended product life support.
  • Robust:  Rich feature-set including 802.11b/g/n WiFi and Dual-Mode Bluetooth.
  • Secure:  Supports the latest WPA3 security standards.
  • Industrial Temp: Supports -40 to +85°C industrial temperature operation

Register For a Chance to Win: Low-Power IoT Connectivity Modules with WPA3

Start prototyping your next IoT application today. Register for a chance to win one of four Sterling-LWB+ WiFi development kits.

The kits contain:

  • Sterling-LWB+ DVK Board (chip antenna or MHF4 connector)
  • 2.4 GHz FlexPIFA antenna (MHF4 version only)
  • 10x jumper pin connector

Register to Win

Sterling LWB+ with MHF4 Connector

Specifications

Wireless Specification
Wi-Fi 4 (802.11b/g/n
Bluetooth 5.2
Chipset (Wireless)
Infineon CYW43439
Dimensions
12 x 12 x 3 mm (SiP Module)
21 x 15 x 4 mm (PCB Module)
Antenna Options
MHF4, Integrated on-board chip antenna, or RF pin
Certifications
FCC, ISED, CE, MIC RCM
Frequency
2.4 GHz (Single Band)
Interfaces - General
SDIO v2.0 (WLAN)
HCI HS-UART, PCM (Bluetooth)
Operating Temp (Max) (°C)
+85 °C
Operating Temp (Min) (°C)
-40 °C
Transmit Power (Max)
+18 dBm
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00083C Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 Antenna Trace SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, SiP Module Bulk, Cut Tape
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00083R Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 Antenna Trace SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, SiP Module Bulk, Tape and Reel
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Frequency Range (Min) Frequency Range (Max) Additional Description
453-00084-K1 Development Kit 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 MHF4 Connector 2400 MHz 2400 MHz Sterling LWB+ Development Kit, MHF4 Connector
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00084C Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 MHF4 Connector SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, PCB Module with MHF4 Connector Bulk, Cut Tape
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00084R Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 MHF4 Connector SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, PCB Module with MHF4 Connector Bulk, Tape and Reel
Product Type Technology OS/Software System Architecture Antenna Type Frequency Range (Min) Frequency Range (Max) Chipset (Wireless) Additional Description
453-00085-K1 Development Kit 802.11bgn, Bluetooth 5.2 Linux Hosted Chip Antenna 2400 MHz 2400 MHz Infineon CYW43439 Sterling LWB+ Development Kit, Chip Antenna
Product Type Technology OS/Software System Architecture Chipset Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00085C Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 Chip Antenna SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, PCB Module with Chip Antenna Bulk, Cut Tape
Product Type Technology OS/Software System Architecture Chipset Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Additional Description Bulk or Single
453-00085R Embedded Module 802.11bgn, Bluetooth 5.2 Linux Hosted Infineon CYW43439 Chip Antenna SDIO, HS-UART, PCM 2400 MHz 2400 MHz Sterling LWB+, PCB Module with Chip Antenna Bulk, Tape and Reel

Photo Gallery

453-00083C

453-00085C

453-00084-K1

453-00085-K1

453-00084C

453-00084R

453-00085R

453-00083R

Certified Antennas

  • 2.4 GHz Dipole RF Antenna

    001-0001

    2.4 GHz Dipole WiFi & Bluetooth Antenna

    2.4 GHz Dipole Antenna 

    Learn More
  • FlexPIFA and FlexPIFA 6E

    001-0014

    FlexPIFA / FlexPIFA 6E Flexible Adhesive-Backed PIFA Internal Antennas

    001-0014: FlexPIFA antenna, 2.4 GHZ 

    Industry-first, flexible, planar inverted-F antennas for curved surfaces.

    2.5-3 dBi gain.

    Available in 2.4 GHz, dual-band 2.4/5 GHz and Wi-Fi 6E 2.4/5/6 GHz.

    Learn More
  • FlexNotch Antenna

    001-0015

    FlexNotch 2.4 GHz Antenna

    FlexNotch is the only adhesive-backed, flexible notch antenna that can be easily custom-trimmed for maximum range within your specific enclosure. Linear polarization with a 2 dBi gain @ 2.4GHz frequency.

    Learn More
  • mFlexPIFA Antenna

    001-0030

    mFlexPIFA Flexible Adhesive-Backed PIFA Internal Antenna

    FlexPIFA antenna for metal mounting with minimal detuning. 2.4 GHz and dual-band 2.4/5.5 GHz with 2 dBi of gain. 

    Learn More

Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Documentation

Name Part Type Last Updated
Product Brief - Sterling LWB+ All Product Brief 02/25/2022
AS/NZS Certifications - Sterling LWB+ All Certification 01/04/2022
CE Certifications - Sterling LWB+ All Certification 01/04/2022
IC Certifications - Sterling LWB+ All Certification 01/04/2022
FCC Certifications - Sterling LWB+ All Certification 01/04/2022
JP Certifications - Sterling LWB+ All Certification 01/04/2022
Datasheet - Sterling-LWB+ All Datasheet 04/14/2022
Regulatory Information Guide - Sterling-LWB+ All Certification 02/01/2022
RoHS 3 Compliance - Wi-Fi Products All Certification 02/16/2022
3D Model - Sterling LWB+ SiP (453-00083) All Technical Drawings 03/09/2022
3D Model - Sterling LWB+ Module, MHF4 (453-00084) All Technical Drawings 03/09/2022
3D Model - Sterling LWB+ Module, Chip Antenna (453-00085) All Technical Drawings 03/09/2022
PCB Footprint (DXF and Altium) - Sterling LWB+ All Technical Drawings 03/09/2022
SCH Symbols (Altium format) - Sterling-LWB+ All Technical Drawings 03/09/2022
CAD Files Sterling-LWB/LWB+ U.FL and Chip Antenna SD Cards All Technical Drawings 03/09/2022
Software, Sterling-LWB, LWB5, and LWB5+ All Software 04/14/2021
Reference Design - Sterling-LWB+ (.DXF Format) All Technical Drawings 04/29/2022
User Guide - Sterling-LWB+ SiP Reference Design All Documentation 04/29/2022
EVK Schematic - Sterling-LWB+ All Technical Drawings 05/27/2022

FAQ

I have a Ubuntu system that has automatic updates will this affect my Wi-Fi?

Yes as new kernels are updated in Ubuntu automatically it will break backports and will need to be reinstalled.

What are some disadvantages of using AP+STA?

The AP and STA are on the same channel potentially causing disconnections if the STA roams to a different AP. The Sterling-70 has the advantage of dual independent radios that can run on different Wi-Fi channels.

What versions of Android are supported by Laird Wi-Fi modules?

This can be found by reviewing the release notes for the specific product on GitHub.

 

How will Laird handle the FRAG attack announced by Wi-Fi Alliance in 2021 May?

Please refer this blog as below. Laird are currently investigating these issues internally and investigating with the chipset vendors and our internal QA team to establish test scenarios to evaluate the impacted devices.

https://www.lairdconnect.com/resources/blog/frag-attack-wi-fi-putting-pieces-back-together

Can I use VOUT_3P3 to power VDDIO?

No, if VBAT is 3.6V or greater, this power source should be used for VDDIO_RF, and USB2_AVDD33 if strapped for USB. Otherwise leave this pin disconnected.

What is the MCS index for Wi-Fi?

MCS stands for Modulation Coding Scheme and is an industry metric index based on Wi-Fi connection parameters between a client and wireless access point. These parameters include modulation type, coding rate, spatial streams, channel width, and guard interval.

Can I use a Laird WiFi module on Ubuntu?

Laird modules can be used on a Ubuntu system with a kernel version that is supported by Laird backports.

To check, find the kernel version of the Ubuntu system and then check the release notes of the products to see if the latest backports supports that kernel.

Sterling-60 Release Notes

Sterling-LWB Release Notes

Is there a way to extend the shelf life of Laird modules?? If the shelf life cannot be extended in any way, what are the consequences of using modules after shelf life?

The shelf life statements are essentially to prevent mishandling of the product and not storing it properly. If the modules are still sealed in the package, stored at the proper temperature and have not been exposed to moisture they should be fine. However, when working with modules beyond their shelf life you MUST bake the modules before populating the them to your board. Failure to bake the modules could result in the yield rate dropping down lower than expectation due to popcorn or de-lamination on the modules. It is recommended that you follow IPC/JEDEC J-STD-033 which is the general standard for the handling, packing, shipping and use of moisture/reflow sensitive surface mount devices.

Our main concern is around the castellation/pads which solder the module to the board. It is imperative those pads do not get tarnished, as this would cause soldering issues. Humidity can affect solderability as well, as if there is any excess moisture in the solder on the module, during reflow of the module to the board, steam balls can essentially explode the solder and sometimes result in an open circuit (or possibly a short circuit).

As long as all of the moisture handling and temperature guidelines are being followed you will likely have no issues. It is further recommended that when you do the build with modules that have exceeded their shelf life that you start with a handful to perform a test run and do a final test to make sure all is working as expected. As long as there are no issues with the initial test run we would expect that you will not experience any problems.

How to set regulation domain in LWB/LWB5/LWB5+ with latest release 8.5.0.7 and later release in Linux platform?

(1) By option regdomain

/etc/modprobe.d/brcmfmac.conf

# Sample contents of a brcmfmac.conf file configured for operation in
#  the United States
options brcmfmac regdomain="US"

(2) By device tree

@mmc0 {
  #address-cells = <1>;
  #size-cells = <0>;
  bus-width = <4>;
  non-removable;

  brcmf: wifi@1 {
    reg = <1>;
    compatible = "brcm,bcm4329-fmac";
    laird,regdomain = "US";
  };
};