TiWi-C-W 802.11b/g/n WiFi Module

End of Life (EOL)

Overview

Integrated 802.11 b/g/n WiFi Module

This stand-alone WLAN (IEEE 802.11 b/g/n) module simplifies the work of adding WiFi connectivity to your products on one of the smallest footprints available. The TiWi-C-W module’s breadth of capabilities ensures a straight-forward integration with your product design, including a pre-loaded cloud connectivity agent for Laird Connectivity’s TiWiConnect™ platform.

The TiWi-C-W module is able to support both hostless operations with client applications running directly on its application processor, as well as hosted operations utilizing a device’s existing microcontroller via a serial UART interface. Development time and complexity is dramatically reduced for a hosted application, as Laird Connectivity’s new TiWiConnect LIFT software offers a simple, intuitive protocol for the embedded software developer. This is the simplest module on the market to integrate WiFi into your product.

Specifications

Certifications
FCC, ISED, EU
Development Tools
Integration directly into M3 processor, or simple integration over UART interface to external microcontrollers or microprocessors
Dimension (Height - mm)
1.35 mm
Dimension (Length - mm)
10.5 mm
Dimension (Width - mm)
10.5 mm
Interfaces - General
UART
Line
Professional
Operating Temp (Max) (°C)
+85
Operating Temp (Min) (°C)
-40
Receive Sensitivity
-90 dBm, 8% PER,11 Mbps (b)
-73 dBm, 10% PER, 54 Mbps (g)
-71 dBm, 10% PER, MCS7 (n)
Transmit Current
Typical 310 mA Max 360mA (11b, 11 Mbps)
Typical 280 mA Max 320mA (11g, 54 Mbps)
Typical 220 mA Max 2700 mA (11n, MCS7)
Transmit Power
+19.0 dBm, 1 Mbps, CCK (b)
+15.8 dBm, 54 Mbps, OFDM (g)
+15.0 dBm, HT20 MCS7 (n)
Voltage
3.13 V - 3.46 V
Wi-Fi Chipset
BCM 4390
Wi-Fi Spec
b/g/n
Part NumberAdditional DescriptionAntenna TypeChipset (Wireless)Frequency Range (Max)Frequency Range (Min)Frequency Range 2 (Max)Frequency Range 2 (Min)Logical InterfacesProduct TypeSystem ArchitectureTechnology
450-0118C
End of Life (EOL)
TiWi-C-W Module, CT External Broadcom BCM4390 2495 MHz2400 MHz5825 MHz5150 MHzSerial Embedded Module Hosted/Hostless 802.11bgn
450-0118R
End of Life (EOL)
TiWi-C-W Module, TR External Broadcom BCM4390 2495 MHz2400 MHz5825 MHz5150 MHzSerial Embedded Module Hosted/Hostless 802.11bgn
450-0143
End of Life (EOL)
TiWi-C-W Dev Kit featuring TiWiConnect External Broadcom BCM4390 2495 MHz2400 MHz5825 MHz5150 MHzSerial Development Kit Hosted/Hostless 802.11bgn
450-0164
End of Life (EOL)
TiWi-C-W Development Board External Broadcom BCM4390 2495 MHz2400 MHz5825 MHz5150 MHzSerial Development Kit Hosted/Hostless 802.11bgn

Documentation

Name Part Type Last Updated
TiWi-C-W Programming Application All Software 03/29/2019
Chip Antenna App Note All Documentation 03/29/2019
Datasheet All Datasheet 03/29/2019
Module Application Guide All Documentation 03/29/2019
Product Brief All Product Brief 03/29/2019
TiWi-C-W EN 60950-1 2006 Test Report All Documentation 03/29/2019
2 Layer CAD Download (940-0122) All Technical Drawings 03/29/2019
4 Layer CAD Download (940-0118) All Technical Drawings 03/29/2019
SCH/PCB Models CAD Downloads(450-0118) All Technical Drawings 03/29/2019
Evaluation Platform User Guide All Documentation 03/29/2019
TiWi-C-W Evaluation Platform EN 60950-1 2006 Test Report All Documentation 03/29/2019
TiWiConnect Brochure All Documentation 03/29/2019
Conflict Minerals Statement All Quality and Environmental 03/29/2019
EU RoHS (2011/65/EU) All Quality and Environmental 03/29/2019
Product Life Cycle Policy All Quality and Environmental 03/29/2019
Reach Chemical Analysis All Quality and Environmental 03/29/2019
WEEE Statement All Quality and Environmental 03/29/2019
Declaration of Conformity: Eval Platform (DoC) All Certification 03/29/2019
Declaration of Conformity: Module (DoC) All Certification 03/29/2019

Certified Antennas

  • 001-0014

    001-0014

    FlexPIFA / FlexPIFA 6E Flexible Adhesive-Backed PIFA Internal Antennas

    001-0014: FlexPIFA antenna, 2.4 GHZ 

    Learn More

FAQ

What is Laird Connectivity's product lifecycle EOL and PCN policy?

Laird Connectivity is committed to the long-term supply of all its standard embedded wireless modules and packaged products. Laird Connectivity’s products are specifically designed to meet the needs of the industrial and medical markets, which typically require 7 – 10 years product lifecycle. Although Laird Connectivity can’t guarantee that a component used in our products will not be obsoleted and cannot be reasonably substituted, Laird Connectivity can assure customers we will continue to sell our product when we have customer demand and can obtain the necessary components to build our products.

View our full policy here. 

Who is responsible for providing the Bluetooth QDID for a host system?

The responsability for providing the QDID for a host system is with the provider of the stack that is used on that system. If for instance the host system uses a module that requires the Bluetooth stack to run on that system (e.g. Lairds Sterling-LWB in a Linux platform) the QDID must be provided by the stack vendor whos stack is running on that Linux platform. Challenges might occur when an open-source, community based stack is used. If a module with integrated stack us used (e.g. Lairds BL652) the QDID is provided by the module vendor.  

 

 

Does Laird Connectivity provide 3D files for modules?

Laird Connectivity provides 3D files (STEP) files for most but not all of it's modules.  Based on the nature of the information in the files, in most cases Laird requires a login to access these files as well as layout files and software/firmware downloads.  As such, for most modules, the 3D files are found under the Software Downloads tab of the product page.  The page offers a credentials request link for customers who need credentials.  In most cases, the credentials are provided via return email within about 10 minutes. Please contact support if you have any additional questions or have any issues accessing our downloads.

Do we recommend conformal coating your modules?

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

How many reflows do you recommend for your modules?

We only recommend reflowing our modules once as it can damage the module and void the warranty.

Why is the TiWiConnect LIFT software an innovative alternative to AT commands Sets?

The TiWiConnect platform and LIFT Device Designer Tool work in conjunction with the TiWi Connect Cloud and LIFT server. It is a rapid development tool that provides a graphical design environment to program the TiWi modules to send customized data to the TiWiConnect cloud server. Changes can be easily made and rapidly deployed, avoiding time consuming command line development. Learn more about our IoT Platforms.

What are the available CAD file formats?

Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers). 

What's the recommended process to clean modules?

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.  

TiWi-CW (Serial-to-Wifi): The "TiWiWiFi_Join" command described in "API.pdf" has an example without any parameters. What does that do?

This will join using previously configured parameters, assuming the "autoJoin":true has been set previously.

Is Tiwi-C-W limited to 4Mbps for throughput due to baud rate limitation for UART?

Yes, that is correct. In addition, the WICED SDK does not use the UART FIFO hardware which limits throughput to

Is there a way to join with a "choice" of possible encryptions on the TiWi-C-W?

Question: TiWi-C-W(Serial-to-Wifi) : Is there a way to join with a "choice" of possible encryptions? (for instance WEP, or WPA, that would encompass all the options and simplify the connection. It's likely the end-user may have some idea of the encryption type, but will not know the details, such AES or TKIP...)

Answer: The Broadcom SDK requires the security type to be specified exactly. If you don't know, it's necessary to do a scan using the API and use the value returned by the module.

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  • Product & Industrial Design

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