Integrated 802.11 b/g/n WLAN Module
This stand-alone WLAN (IEEE 802.11 b/g/n) module simplifies the work of adding Wi-Fi connectivity to your products on one of the smallest footprints available. The TiWi-C-W module’s breadth of capabilities ensures a straight-forward integration with your product design, including a pre-loaded cloud connectivity agent for LSR’s TiWiConnect™ platform.
The TiWi-C-W module is able to support both hostless operations with client applications running directly on its application processor, as well as hosted operations utilizing a device’s existing microcontroller via a serial UART interface. Development time and complexity is dramatically reduced for a hosted application, as LSR’s new TiWiConnect LIFT software offers a simple, intuitive protocol for the embedded software developer. This is the simplest module on the market to integrate Wi-Fi into your product.
-73 dBm, 10% PER, 54 Mbps (g)
-71 dBm, 10% PER, MCS7 (n)
Typical 280 mA Max 320mA (11g, 54 Mbps)
Typical 220 mA Max 2700 mA (11n, MCS7)
+15.8 dBm, 54 Mbps, OFDM (g)
+15.0 dBm, HT20 MCS7 (n)
|450-0118C||TiWi-C-W Module, CT|
|450-0118R||TiWi-C-W Module, TR|
|450-0143||TiWi-C-W Dev Kit featuring TiWiConnect|
|450-0164||TiWi-C-W Development Board|
|TiWi-C-W Programming Application||All||Software||03-29-19|
|Chip Antenna App Note||All||Documentation||03-29-19|
|Module Application Guide||All||Documentation||03-29-19|
|TiWi-C-W EN 60950-1 2006 Test Report||All||Documentation||03-29-19|
|2 Layer CAD Download (940-0122)||All||Technical Drawings||03-29-19|
|4 Layer CAD Download (940-0118)||All||Technical Drawings||03-29-19|
|SCH/PCB Models CAD Downloads(450-0118)||All||Technical Drawings||03-29-19|
|Evaluation Platform User Guide||All||Documentation||03-29-19|
|TiWi-C-W Evaluation Platform EN 60950-1 2006 Test Report||All||Documentation||03-29-19|
|Conflict Minerals Statement||All||Quality and Environmental||03-29-19|
|EU RoHS (2011/65/EU)||All||Quality and Environmental||03-29-19|
|Product Life Cycle Policy||All||Quality and Environmental||03-29-19|
|Reach Chemical Analysis||All||Quality and Environmental||03-29-19|
|WEEE Statement||All||Quality and Environmental||03-29-19|
|Declaration of Conformity: Eval Platform (DoC)||All||Certification||03-29-19|
|Declaration of Conformity: Module (DoC)||All||Certification||03-29-19|
|Radio Equipment Directive (RED) Updates||All||Certification||03-29-19|
Do we recommend conformal coating your modules?
We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function). You should run tests on their particular potting compound and evaluate radio's performance and range. Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.
How many reflows do you recommend for your modules?
We only recommend reflowing our modules once as it can damage the module and void the warranty.
Is there a way to join with a "choice" of possible encryptions on the TiWi-C-W?
Question: TiWi-C-W(Serial-to-Wifi) : Is there a way to join with a "choice" of possible encryptions? (for instance WEP, or WPA, that would encompass all the options and simplify the connection. It's likely the end-user may have some idea of the encryption type, but will not know the details, such AES or TKIP...)
Answer: The Broadcom SDK requires the security type to be specified exactly. If you don't know, it's necessary to do a scan using the API and use the value returned by the module.
Is Tiwi-C-W limited to 4Mbps for throughput due to baud rate limitation for UART?
Yes, that is correct. In addition, the WICED SDK does not use the UART FIFO hardware which limits throughput to
TiWi-CW (Serial-to-Wifi): The "TiWiWiFi_Join" command described in "API.pdf" has an example without any parameters. What does that do?
This will join using previously configured parameters, assuming the "autoJoin":true has been set previously.
What are the available CAD file formats?
Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers).
What's the recommended process to clean modules?
The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.
Who is responsible for providing the Bluetooth QDID for a host system?
The responsability for providing the QDID for a host system is with the provider of the stack that is used on that system. If for instance the host system uses a module that requires the Bluetooth stack to run on that system (e.g. Lairds Sterling-LWB in a Linux platform) the QDID must be provided by the stack vendor whos stack is running on that Linux platform. Challenges might occur when an open-source, community based stack is used. If a module with integrated stack us used (e.g. Lairds BL652) the QDID is provided by the module vendor.
Why is the TiWiConnect LIFT software an innovative alternative to AT commands Sets?
The TiWiConnect platform and LIFT Device Designer Tool work in conjunction with the TiWi Connect Cloud and LIFT server. It is a rapid development tool that provides a graphical design environment to program the TiWi modules to send customized data to the TiWiConnect cloud server. Changes can be easily made and rapidly deployed, avoiding time consuming command line development. Learn more about our IoT Platforms.
Does Laird Connectivity provide 3D files for modules?
Laird Connectivity provides 3D files (STEP) files for most but not all of it's modules. Based on the nature of the information in the files, in most cases Laird requires a login to access these files as well as layout files and software/firmware downloads. As such, for most modules, the 3D files are found under the Software Downloads tab of the product page. The page offers a credentials request link for customers who need credentials. In most cases, the credentials are provided via return email within about 10 minutes. Please contact support if you have any additional questions or have any issues accessing our downloads.