TiWi-uB2

Not Recommended for New Design (NRND)

Overview

Bluetooth Smart Ready Module

The TiWi-uB2 Bluetooth module is a high performance 2.4 GHz Bluetooth 2.1+EDR and Bluetooth Low Energy - Smart Ready radio in a cost effective, pre-certified footprint. The highly integrated TiWi-uB2 module makes the use of Bluetooth headsets and other applications possible. This module fully supports the dual mode Bluetooth and BLE operation, and the output power can support class 1.5. The SIP module provides UART interface/audio PCM interface for Bluetooth through the HCI transport layer.

The SIP module is specifically developed for Smart phones and Portable devices.

Specifications

Antenna Options
External via Trace Pad
Bluetooth Version
Bluetooth 2.1+EDR, 4.0 (BLE)
BT Capable
Complete Power-Optimized Stack
Controller and Host
GAP - Central, Peripheral, Observer, or Broadcaster
ATT / GATT - Client and Server
SMP - AES - 128 Encryption and Decryption
L2CAP
Certifications
FCC, IC, Giteki, SIG, CE
Chipset
TI CC2564
Dimension (Height - mm)
7 mm
Dimension (Length - mm)
7 mm
Dimension (Width - mm)
1.5 mm
Interfaces
HCI, UART, and Audio PCM interfaces. Compact design based on TI CC2564 Transceiver
Operating Temp - Max (°C)
+85 °C
Operating Temp - Min (°C)
-30 °C
Output Power
10 dBm
Receive Sensitivity
-93 dBm, GFSK at 0.1% BER
-85 dBm, 8DPSK at 0.01% BER
Transmit Current
47.1 mA, DM1 Packet
30.2 mA, DH1 Packet
13.0 mA, DH5 Packet
Voltage
VBAT Min, VDD_IO Min: 2.2 V to 1.62 V
VBAT Max, VDD_IO Max: 4.8 V to 1.92 V
Additional Description
450-0104 TiWi-uB2 Module, Tray
Additional Description
450-0104R TiWi-uB2 Module, TR
Additional Description
450-0105 TiWi-uB2 EM Board

Certified Antennas

  • 2.4 GHz Dipole RF Antenna

    001-0001

    2.4 GHz Dipole RF Antennas
    Learn More
  • 2.4 GHz Dipole RF Antenna

    001-0010

    2.4 GHz Dipole RF Antennas
    Learn More

Documentation

Name Part Type Last Updated
Bluetooth Eval Tool All Software 03-29-19
Bluetooth Patch File: ETSI BT 4.0 all certified antennas All Software 03-29-19
Bluetooth Patch File: FCC/IC/ETSI BT 2.1 + EDR, FCC/IC BT 4.0 all certified antennas All Software 03-29-19
Bluetooth Patch File: Used with the Bluetooth Eval Tool All Software 03-29-19
WLAN and Bluetooth Radio Tools User Guide All Software 05-01-19
Antenna Design Guide All Documentation 03-29-19
Datasheet All Datasheet 03-29-19
Product Brief All Brochure 03-29-19
3D Models CAD Downloads (8-11-2012)(450-0104) All Technical Drawings 03-29-19
SCH/PCB Models CAD Downloads (12-3-2012)(450-0104) All Technical Drawings 03-29-19
EM Board User Guide All Documentation 03-29-19
EM Board CAD Download (12-3-2012) (450-0105) All Technical Drawings 03-29-19
Bluetooth SIG Listing All Quality and Environmental 03-29-19
Conflict Minerals Statement All Quality and Environmental 03-29-19
EU RoHS (2011/65/EU) All Quality and Environmental 03-29-19
FCC Bluetooth Grant All Quality and Environmental 03-29-19
Product Change Notice (TiWi-uB2) All Quality and Environmental 03-29-19
Product Life Cycle Policy All Quality and Environmental 03-29-19
Reach Chemical Analysis All Quality and Environmental 03-29-19
WEEE Statement All Quality and Environmental 03-29-19
Declaration of Conformity: Module (DoC) All Certification 03-29-19
Radio Equipment Directive (RED) Updates All Certification 03-29-19

FAQ

Can I develop my application directly on the TiWi-uB2 module?

The TiWi-uB2 module requires a host processor or microcontroller to be used in conjunction with the module. The upper layers of the Bluetooth or BLE stack runs on the host processor/microcontroller along with the application.

Can I use the Manufacturer's Specific AD record Data Type for Proprietary Data?

The Manufacturer's Specific Data Type is used for manufacturer specific data which can be proprietary data structures defined by the manufacturer and only identifiable by manufacturer's equipment/applications. To use the Manufacturer's Specific Data Type you need to have a Company Identifier as assigned by the BT SIG. You must be a registered member of the BT SIG and must apply for the company identifier using the process below (found at this link: https://www.bluetooth.com/specifications/assigned-numbers/company-ident…)   Application & Assignment Process Submit the following below to  Bluetooth Support : Company information (legal name of company) Name of company's primary contact (name and email) A statement that your company is currently a Bluetooth SIG member in good standing* Please allow five business days for your request to be fulfilled, and two business days from the time your request is fulfilled to view your Company Identifier on this page. *  ? BLUETOOTH Member in Good Standing ? shall mean any firm, corporation or other legal entity that has been admitted to membership in the BLUETOOTH SIG, whether a Promoter Member, Associate Member or Adopter Member, as defined in the organizational documents, that has fulfilled all of the requirements for membership, has paid and is current with payment of any and all membership fees, dues and assessments, and whose membership neither has been voluntarily or involuntarily suspended, terminated, or withdrawn from membership consistent with the lawful provisions of the organizational documents of the BLUETOOTH SIG.?

Do we recommend conformal coating your modules?

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

Does the TiWi-uB2 module support both Classic Bluetooth and Bluetooth Low Energy (BLE)?

Yes the TiWi-uB2 module is a dual mode Bluetooth Smart Ready device, that supports both Classic and BLE.

How can I test WLAN on the TiWi Series?

The TiWi-BLE can be tested a couple of ways. Either with the TiWi WLAN Eval Tool or in Linux with the following weblink to guide on how to do that. The customer needs to read through our product documentation before going to the following Ti page: http://processors.wiki.ti.com/index.php/WL127x_TX_Testing

Before we suggest using the Ti link above, the module must be calibrated, those steps and instructions are in the Documentation section on the product page.

 

 

How many reflows do you recommend for your modules?

We only recommend reflowing our modules once as it can damage the module and void the warranty.

My TiWi-uB2 eval board is returning ?Error connecting to BT device!!! Err:-199?

You may be experiencing a timeout exception because the module is not responding to a command. Please be aware that you must use flow control or CTS and RTS need to be connected together. Additionally, nShutdown needs to be driven high.

What are the available CAD file formats?

Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers). 

What criteria should be confirmed when soldering Bluetooth modules?

The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.

What is the peak current for the TiWi-uB2 module?

While the datasheet lists the typical current draw of 47.1mA at 3.3 VDC, the max current is 70 to 75 mA at 3.3 VDC for the TiWi-uB2

What is the recommendation for washing BT/BLE modules?

We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.

What's the recommended process to clean modules?

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.  

Which antennas are certified with the TiWi-uB2 module?

The TiWi-uB2 module is certified with the Laird Connectivity 2.4 GHz Dipole and 2.4 GHz Waterproof Dipole antennas, used in conjunction with any of our U.FL to Reverse Polarity SMA cables. Additionally the module is also certified with an off module Johanson Technology 2450AT43B100 chip antenna. Consult the Antenna Design Guide for details on implementing the TiWi-uB2 module into your design with one of the above certified antenna options.

Does Laird Connectivity provide 3D files for modules?

Laird Connectivity provides 3D files (STEP) files for most but not all of it's modules.  Based on the nature of the information in the files, in most cases Laird requires a login to access these files as well as layout files and software/firmware downloads.  As such, for most modules, the 3D files are found under the Software Downloads tab of the product page.  The page offers a credentials request link for customers who need credentials.  In most cases, the credentials are provided via return email within about 10 minutes. Please contact support if you have any additional questions or have any issues accessing our downloads.