BTM441 & BTM443 Series Bluetooth Module
Overview
The BTM44x series Bluetooth modules from Laird Connectivity have been designed to meet the needs of developers who wish to add robust, short-range Bluetooth data connectivity to their products. They are based on the market-leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with outstanding range. These modules support the latest Bluetooth Version 2.1 Specification, providing the important advantage of Secure Simple Pairing, which improves security and enhances the ease of use for end customers. In addition to Serial Port Profile, the BTM44x series features a number of additional features and profiles not found on other Bluetooth modules. Available in BTM440, BTM441, BTM442, and BTM443 variants.
Specifications
+4 dBm (from integrated antenna BTM441/443)
Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Bluetooth Version | Connector | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | Input Power | Transmit Power (Max) | Power Consumption | Protocols | Receive Sensitivity | Software | Wi-Fi Coexistence | Wireless Specification | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BTM441 | Embedded Module | Bluetooth Classic, Bluetooth 2.1 + EDR | AT Commands, Embedded Stack | Hosted | QCA (CSR) BC04 | Internal | Serial | 2402 MHz | 2480 MHz | v2.1 + EDR | SMT | 3.4 mm | 22 mm | 12.5 mm | 3.0 - 3.3V | +4 dBm | < 40mA | AT Command Set | -84 dBm | Terminal Software | 2 wire and 3 wire schemes supported | Bluetooth v2.1 + EDR |
Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Bluetooth Version | Connector | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | Input Power | Transmit Power (Max) | Power Consumption | Protocols | Receive Sensitivity | Software | Wi-Fi Coexistence | Wireless Specification | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BTM443 | Embedded Module | Bluetooth Classic, Bluetooth 2.1 + EDR | AT Commands, Embedded Stack | Hosted | QCA (CSR) BC04 | Internal | Serial | 2402 MHz | 2480 MHz | v2.1 + EDR | SMT | 3.4 mm | 22 mm | 12.5 mm | 3.0 - 3.3V | +4 dBm | < 40mA | Multipoint Mode | -84 dBm | Terminal Software | 2 wire and 3 wire schemes supported | Bluetooth v2.1 + EDR |
Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Bluetooth Version | Connector | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | Input Power | Transmit Power (Max) | Power Consumption | Protocols | Receive Sensitivity | Software | Wi-Fi Coexistence | Wireless Specification | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DVK-BTM441 | Development Kit | Bluetooth Classic, Bluetooth 2.1 + EDR | AT Commands | Hosted | QCA (CSR) BC04 | Internal | USB, Serial | 2402 MHz | 2480 MHz | v2.1 + EDR | USB Pluggable | 3.4 mm | 22 mm | 12.5 mm | 3.0 - 3.3V | +4 dBm | < 40mA | AT Command Set | -84 dBm | Terminal Software | 2 wire and 3 wire schemes supported | Bluetooth v2.1 + EDR |
Product Type | Technology | OS/Software | System Architecture | Chipset (Wireless) | Antenna Type | Logical Interfaces | Frequency Range (Min) | Frequency Range (Max) | Bluetooth Version | Connector | Dimension (Height - mm) | Dimension (Length - mm) | Dimension (Width - mm) | Input Power | Transmit Power (Max) | Power Consumption | Protocols | Receive Sensitivity | Software | Wi-Fi Coexistence | Wireless Specification | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DVK-BTM443 | Development Kit | Bluetooth Classic, Bluetooth 2.1 + EDR | AT Commands | Hosted | QCA (CSR) BC04 | Internal | USB, Serial | 2402 MHz | 2480 MHz | v2.1 + EDR | USB Pluggable | 3.4 mm | 22 mm | 12.5 mm | 3.0 - 3.3V | +4 dBm | < 40mA | Multipoint Mode | -84 dBm | Terminal Software | 2 wire and 3 wire schemes supported | Bluetooth v2.1 + EDR |
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Documentation
BT 2.1 - SSP initiated by a BTM module
This article is designed to illustrate the process of Simple Secure Pairing (SSP) when initiated from a BTM module. Introduced in Bluetooth v2.1, SSP creates a bond in a very different way than the legacy PIN pairing many users are familiar with. This is demonstrated both for security level 2 (default) and security level 3.
Security Level = 2
Assumptions:
peer device is BT2.1 (supporting secure simple pairing)
security level of BTM device is
security level of peer device is
the pairing initiating device is aware of the peer device's Bluetooth Device Address
Note: Connections in Bluetooth v2.1 are always encrypted.
Figure 1: BTM vs BTM
Figure 2: BTM vs PC
Security Level = 3
Assumptions:
peer device is BT2.1 (supporting secure simple pairing)
at least one device with security level = 3 (MITM protection / authentication enabled)
the pairing initiating device is aware of the peer device's Bluetooth Device Address
Remarks:
Connections with BT2.1 are always encrypted
"MITM" = Man-In-The-Middle. "MITM protection" means "protection against a MITM attack".
MITM protection is equivalent with authentication
Figure 3: BTM vs BTM, security level 3
Figure 4: BTM vs PC, security level 3
Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.
- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
- Ultrasonic cleaning could damage the module permanently.
However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.
What is the throughput of your bluetooth modules with the embedded AT command interface?
Our fully-embedded modules have a throughput of around 300-360 kbps. They have an on-board Bluetooth stack and do all of the Bluetooth processing themselves. Bluetooth 2.1 + EDR has a practical transfer rate of 2.1 Mbit/s, but this is not possible on a small embedded module that does not have a powerful PC-type processor.