Overview

The BTM420/BTM421 Bluetooth modules are designed to meet the needs of developers adding robust, short range Bluetooth data connectivity to their products and using embedded Bluetooth stacks within these products. They are based on the market-leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with outstanding range. Supporting the latest Bluetooth Version 2.1 Specification with EDR (Enhanced Data Rate), HCI Data Modules increase data throughput up to 2.1 Mbps. BT version 2.1 provides the advantage of Secure Simple Pairing that improves security and enhances ease of use for end customers.

Note: The BTM420-xx and BTM421-xx variants have reached end of production and are available on a limited basis only. Find the End of Life Announcement in the Documentation tab below.

Specifications

Antenna Options
Integrated antenna or External via Trace Pin
Bluetooth Version
v2.1 + EDR
Chipset
CSR BC04
Connector Type
SMT
Development Kit Contents
Development board
Dimension (Height - mm)
3.4 mm
Dimension (Length - mm)
22 mm
Dimension (Width - mm)
12.5 mm
Frequency
2.402 - 2.480 G
Logical Interfaces
SMT
Max Transmit Power
Class 2, +4 dBm (at antenna pad  BTM420), +4 dBm (from integrated antenna  BTM421)
Product Benefits
FCC/IC & CE - Limited Modular Approval<br/>Lead Free & ROHS Compliant
Range
Up to 30 meters
Receive Sensitivity
Better than -84 dBm
Weight
.105 oz (3 g)
Wi-Fi Coexistence
2 wire and 3 wire schemes supported
Wireless Specification
802.11 b/g
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Antenna Options Bluetooth Version Compliance Connector Data Rate Development Kit Contents Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm) Input Power Max Transmit Power Power Consumption Protocols Range Receive Sensitivity Software Weight Wi-Fi Coexistence Wireless Specification
BTM420 Embedded Module Bluetooth Classic, Bluetooth 2.1 + EDR AT Commands, HCI Hosted QCA (CSR) BC04 External HCI 2402 MHz 2480 MHz Trace Pin v2.1 + EDR FCC / IC / CE SMT 2.1 MBps Development board 3.4 mm 18 mm 12.5 mm 3.1 - 3.3V +4 dBm 32mA AT Command Set Up to 30 meters -84 dBm Terminal Software .105 oz (3 g) 2 wire and 3 wire schemes supported Bluetooth v2.1 + EDR
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Bluetooth Version Compliance Connector Data Rate Development Kit Contents Dimension (Height - mm) Dimension (Length - mm) Dimension (Width - mm) Input Power Max Transmit Power Power Consumption Protocols Range Receive Sensitivity Software Weight Wi-Fi Coexistence Wireless Specification
BTM421 Embedded Module Bluetooth Classic, Bluetooth 2.1 + EDR AT Commands, HCI Hosted QCA (CSR) BC04 Internal HCI 2402 MHz 2480 MHz v2.1 + EDR FCC / IC / CE SMT 2.1 MBps Development board 3.4 mm 24 mm 12.5 mm 3.0 - 3.3V +4 dBm 32mA AT Command Set Up to 30 meters -84 dBm Terminal Software .105 oz (3 g) 2 wire and 3 wire schemes supported Bluetooth v2.1 + EDR
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Bluetooth Version Connector Data Rate Max Transmit Power Protocols Range Receive Sensitivity Software Wi-Fi Coexistence Wireless Specification
DVK-BTM420 Development Kit Bluetooth Classic, Bluetooth 2.1 + EDR AT Commands Hosted QCA (CSR) BC04 Internal USB, Serial 2402 MHz 2480 MHz v2.1 + EDR USB Pluggable 2.1 MBps +4 dBm AT Command Set Up to 30 meters -84 dBm Terminal Software 2 wire and 3 wire schemes supported Bluetooth v2.1 + EDR
Product Type Technology OS/Software System Architecture Chipset (Wireless) Antenna Type Logical Interfaces Frequency Range (Min) Frequency Range (Max) Bluetooth Version Connector Data Rate Max Transmit Power Protocols Range Receive Sensitivity Software Wi-Fi Coexistence Wireless Specification
DVK-BTM421 Development Kit Bluetooth Classic, Bluetooth 2.1 + EDR AT Commands Hosted QCA (CSR) BC04 Internal USB, Serial 2402 MHz 2480 MHz v2.1 + EDR USB Pluggable 2.1 MBps +4 dBm AT Command Set Up to 30 meters -84 dBm Terminal Software 2 wire and 3 wire schemes supported Bluetooth v2.1 + EDR

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  • Antenna selection and placement
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  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

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Documentation

Name Part Type Last Updated
Application Note - Bluetooth Latency and Data.pdf All Application Note 01/17/2019
BTM400 Series DoC Sep2014.pdf All Certification 01/17/2019
CE - EN 60950-1 LVD Grant (BTM4x1).pdf.pdf All Certification 01/17/2019
CE - EN 62479 RF Exposure Test Report (BTM4x1).pdf All Certification 01/17/2019
CE - EN 301 489-1-17 WLAN Test Report (BTM4x1).pdf All Certification 01/17/2019
CE - EN 60950-1 LVD Test Report (BTM4x1).pdf All Certification 01/17/2019
EU Declaration of Conformity - BTM4xx - 2017.pdf All Certification 01/17/2019
EN 300 328 (2.4 GHz) BT EDR V1.9.1 - BTM4xx.pdf All Certification 01/17/2019
EN 62311 - RF Exposure - BTM4xx.pdf All Certification 01/17/2019
Radio Equipment Directive (RED) Updates - May 2017 All Certification 03/01/2019
RoHSII - EU WEEE Compliance BT RAMP v1 8 All Certification 07/12/2019
Mini Dev Kit Schematics - BTM42x.pdf All Documentation 01/17/2019
Hardware Integration Guide - BTM42x Modules.pdf All Documentation 01/17/2019
User Guide - BTM42x Module.pdf All Documentation 01/17/2019
EOL - Bluetooth - Nov-15-2015.pdf All Documentation 01/17/2019
Product Brief - BTM42X Modules.pdf All Documentation 01/17/2019
Bluetooth Development Kit Terminal Download.zip All Software 01/17/2019

FAQ

Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. 

  • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
  • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
  • Ultrasonic cleaning could damage the module permanently.

However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.