BISMS02BI Embedded Bluetooth AT Module

Not Recommended for New Design (NRND)

Overview

The Embedded Bluetooth AT Module is designed for applications that demand a robust and reliable Bluetooth connection. This product is designed with solder connections for mounting directly onto a main PCB. The integrated high-performance, multilayer ceramic antenna is highly resistant to de-tuning, allowing great flexibility in positioning.

BISMS02BI is based on Cambridge Silicon Radio’s BlueCore4 chipset. The module contains all of the hardware and firmware for a complete Bluetooth solution, requiring no further components. The module has an integrated high-performance antenna which is matched with the Bluetooth RF and baseband circuitry. The firmware integrated into the module implements the higher layer Bluetooth protocol stack, up to and including the Generic Access Profile (GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP) and Audio Gateway. A virtual processor within the BC04 implements an AT command processor. This interfaces with the host system over a straight forward serial port using an extensive range of AT commands.

Specifications

Bluetooth Version
2.0
Chipset
CSR BC04
Antenna Options
Integrated
BT Class
1
BT Connections
3
Certifications
FCC, ISED, EU, MIC, Bluetooth SIG
Compliance
Lead-free and RoHS compliant
Data Rate
Up to 300 Kbps over UART
Dimension (Height - mm)
5.5 mm
Dimension (Length - mm)
46 mm
Dimension (Width - mm)
18 mm
Dimensions
46mm x 18mm x 5mm
FTP Client
Yes
Frequency Range (Max)
2.480 GHz MHz
Frequency Range (Min)
2.402 GHz MHz
GPIO
6 x digital (DTR can also be allocated as GPIO) ADC - 1 x 8 bit
Interface (Serial)
RS-232 bi-directional for commands and data using AT commands
Logical Interfaces
PCM (x4), ADC (x1), GPIO (x6), UART (Tx, Rx, RTS, CTS, DSR, DRT, DCD, RI)
PCM
Audio can be transferred over SCO channels through the PCM interface at 64 kbps. PCM can be configured as master or slave. Support for dual slave PCM connections.
Power Consumption
Less than 36 mA during data transfer in standard power mode. Lower power use is possible with a configurable low power mode.
Profiles
Server - SPP (Full), DUN, Audio Gateway, Headset, Handsfree
Client - All RFCOMM based profiles
Range
Up to 300m (free space)
Receive Sensitivity
> -86dBm
Serial Parameters
Default 9600,n,8,1 - Configurable from 1,200 bps to 961,200 bps. 7 bit firmware is available – please contact Laird Support for DTR, DSR, DCD, RI, RTS, CTS
Stack On Board
Yes
Temperature Range
-40°C to +85°C
Transmit Power (Max)
+6 dBm
Transmit Power (Min)
-27 dBm
Voltage
3.3 V – 7.0 V
Weight
.21 oz (6 g)
Part NumberAntenna OptionsAntenna TypeBluetooth VersionBulk or SingleChipsetChipset (Wireless)ComplianceConnectorData RateDimension (Height - mm)Dimension (Length - mm)Dimension (Width - mm)Frequency Range (Max)Frequency Range (Min)Input PowerLogical InterfacesOS/SoftwarePhysical InterfaceProduct TypeProtocolsSystem ArchitectureTechnology
BISMS02BI
BISMS02BI
Not Recommended for New Design (NRND)
Buy Now
Internal v2.0 Single CSR BC04 QCA (CSR) BC04 FCC / IC / CE / MIC SMT Up to 300kbps 5.5 mm46 mm15 mm2480 MHz2402 MHz3.3V - 7V PCM, ADC, GPIO, Serial AT Commands, Embedded Stack SMT Embedded Module AT command set Hosted Bluetooth Classic, Bluetooth 2.0
BISMS02BI
BISMS02BI-NA
End of Life (EOL)
u.FL Connector External v2.0 Single CSR BC04 QCA (CSR) BC04 FCC, ISED, EU, MIC SMT Up to 300kbps 5.5 mm46 mm15 mm2480 MHz2402 MHz3.3V - 7V PCM, ADC, GPIO, Serial AT Commands, Embedded Stack SMT Embedded Module AT command set Hosted Bluetooth Classic, Bluetooth 2.0
TRBLU24-00100
Not Recommended for New Design (NRND)
Internal v2.0 Single CSR BC04 QCA (CSR) BC04 FCC, ISED, EU, MIC SMT Up to 300kbps 5.5 mm46 mm15 mm2480 MHz2402 MHz3.3V - 7V PCM, ADC, GPIO, Serial HCI, Embedded Stack SMT Embedded Module HCI Hosted Bluetooth Classic, Bluetooth 2.0
TRBLU24-00100-NA
Not Recommended for New Design (NRND)
Buy Now
u.FL connector External v2.0 Single CSR BC04 QCA (CSR) BC04 FCC, ISED, EU, MIC SMT Up to 300kbps 5.5 mm46 mm15 mm2480 MHz2402 MHz3.3V - 7V PCM, ADC, GPIO, Serial HCI, Embedded Stack SMT Embedded Module HCI Hosted Bluetooth Classic, Bluetooth 2.0

Documentation

Name Part Type Last Updated
Bluetooth SIG - CPD (BISMS02BI).pdf All Certification 01/17/2019
Bluetooth SIG - QNP (BISMS02BI).pdf All Certification 01/17/2019
RoHS 3 - Bluetooth All Certification 01/04/2022
Release Notes - BISM2 Firmware Version 11.28.1.0.pdf All Documentation 01/17/2019
User Guide - BISM2 Serial Module.pdf All Documentation 01/17/2019
User Guide - BISM2 AT Command Set.pdf All Documentation 01/17/2019
Product Brief - BISMS02BI.pdf All Product Brief 10/12/2021
Datasheet - BISMS02BI.pdf All Datasheet 03/01/2019
PCN - BRBLU03 BISMS02 TRBLU23 Antenna - 20 Dec 16.pdf All Documentation 09/14/2021
MultipointHostSourceLibrary BISMII.zip All Software 01/17/2019
Bluetooth Development Kit Terminal Download.zip All Software 01/17/2019
EU Certifications - BISMS02BI All Certification 12/01/2022
FCC and ISED (Canada) Certifications - BISMS02BI All Certification 12/19/2020
NCC Certifications - BISMS02BI All Certification 12/19/2020
Regulatory Information - BISMS02BI All Certification 02/22/2022
EOL - Bluetooth - Nov-15-2015.pdf BISMS02BI-NA Documentation 01/17/2019

FAQ

Is it safe to run a Laird Connectivity Bluetooth module through a PCBA wash cycle?

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. 

  • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
  • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
  • Ultrasonic cleaning could damage the module permanently.

However, if water washing is required you will need to use deionized water. We do not recommend chemical cleaning and cannot guarantee it will not damage the modules. If you MUST clean PCB with chemicals it is recommended that you test on one board and then confirm the module still works after the process, prior to adding it to production, while understanding the above affects washing the populated PCBs can have on the module.

What is Laird Connectivity's product lifecycle EOL and PCN policy?

Laird Connectivity is committed to the long-term supply of all its standard embedded wireless modules and packaged products. Laird Connectivity’s products are specifically designed to meet the needs of the industrial and medical markets, which typically require 7 – 10 years product lifecycle. Although Laird Connectivity can’t guarantee that a component used in our products will not be obsoleted and cannot be reasonably substituted, Laird Connectivity can assure customers we will continue to sell our product when we have customer demand and can obtain the necessary components to build our products.

View our full policy here. 

What is the throughput of your bluetooth modules with the embedded AT command interface?

Our fully-embedded modules have a throughput of around 300-360 kbps.  They have an on-board Bluetooth stack and do all of the Bluetooth processing themselves. Bluetooth 2.1 + EDR has a practical transfer rate of 2.1 Mbit/s, but this is not possible on a small embedded module that does not have a powerful PC-type processor.

What is the recommendation for washing BT/BLE modules?

We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.

What criteria should be confirmed when soldering Bluetooth modules?

The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.

Do we recommend conformal coating your modules?

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

How many reflows do you recommend for your modules?

We only recommend reflowing our modules once as it can damage the module and void the warranty.

Are Laird's BT/ BLE Modules "Intrinsically Safe"?

Yes it is possible that Laird's BLE modules could be utilized in a end device that is certified as"Intrinsically Safe". We do not currently have any end customers doing this with all of Laird's BT/BLE modules, some of our BT/BLE modules have been successfully certified by our customers. As a valuable point of information, Intrinsically Safe certifications are detailed and extensive, requiring NDA restricted information on our modules which we can support based on the commercial opportunity. The detailed analysis and testing of the end production solution is the responsibility of the end customer working with their certified test house. 

What are the available CAD file formats?

Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers). 

What's the recommended process to clean modules?

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.  

Become a Laird Connectivity Customer and Gain Exclusive Access to Our Design Services Team

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Buy Now

Distributor Part In Stock Region Buy
RS BISMS02BI 1 EMEA Buy Now
RS BISMS02BI 1 EMEA Buy Now
RS BISMS02BI 1 EMEA Buy Now
Avnet BISMS02BI 0 North America Buy Now
Digi-Key BISMS02BI 0 North America Buy Now
Newark TRBLU24-00100-NA 0 North America Buy Now

Distributors

Distributor Phone Number Region Website
Alpha Micro UK Only +44 1256-851770
EMEA Website
Arrow Electronics 1-855-326-4757
+44 2039 365486
APAC, North America, South America, EMEA Website
Avnet 1-480-643-2000
+44 1628 512900
APAC, North America, South America, EMEA Website
Cal-Chip Connect 1-215-942-8900
North America Website
Control Synergy +61-2-4966-5211
APAC Website
Digi-Key 1-800-344-4539
North America, South America, APAC, EMEA Website
EBV Elektronik EMEA Website
Farlink Technology +86 13266922199
APAC Website
Farnell 1-800-936-198
+44 3447 11 11 22
EMEA Website
Future Electronics 1-800-675-1619
1-514-428-8470
North America, South America, APAC, EMEA Website
Glyn +49-6126-590-0
EMEA Website
Jetronic China, Hong Kong and Taiwan 852-27636806 
APAC Website
Laird Connectivity 1-847-839-6925
+44 1628 858941
North America, South America, APAC, EMEA Website
M2M Germany +49-6081-587386-0
EMEA Website
Martinsson +46 8 7440300
EMEA Website
McCoy South East Asia +65 6515 2988
APAC Website
Mouser 1-800-346-6873
+44 1494 427500
North America, South America, APAC, EMEA Website
RS Components +852-2421-9898
+44 3457-201201
North America, South America, APAC, EMEA Website
Ryoyo Japan +81-3-3543-7711
APAC Website
Symmetry Electronics 1-866-506-8829
North America Website
Tekdis Australia and New Zealand +61 3 8669 1210
APAC Website
Telsys +972 3 7657666
EMEA Website