The Embedded Bluetooth AT Module is designed for applications that demand a robust and reliable Bluetooth connection. This product is designed with solder connections for mounting directly onto a main PCB. The integrated high-performance, multilayer ceramic antenna is highly resistant to de-tuning, allowing great flexibility in positioning.
BISMS02BI is based on Cambridge Silicon Radio’s BlueCore4 chipset. The module contains all of the hardware and firmware for a complete Bluetooth solution, requiring no further components. The module has an integrated high-performance antenna which is matched with the Bluetooth RF and baseband circuitry. The firmware integrated into the module implements the higher layer Bluetooth protocol stack, up to and including the Generic Access Profile (GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP) and Audio Gateway. A virtual processor within the BC04 implements an AT command processor. This interfaces with the host system over a straight forward serial port using an extensive range of AT commands.
Client - All RFCOMM based profiles
|BISMS02BI||Integrated||AT command set|
|BISMS02BI-NA||u.FL Connector||AT command set|
Are Laird's BT/ BLE Modules "Intrinsically Safe"?
Yes it is possible that Laird's BLE modules could be utilized in a end device that is certified as"Intrinsically Safe". We do not currently have any end customers doing this with all of Laird's BT/BLE modules, some of our BT/BLE modules have been successfully certified by our customers. As a valuable point of information, Intrinsically Safe certifications are detailed and extensive, requiring NDA restricted information on our modules which we can support based on the commercial opportunity. The detailed analysis and testing of the end production solution is the responsibility of the end customer working with their certified test house.
Do we recommend conformal coating your modules?
We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function). You should run tests on their particular potting compound and evaluate radio's performance and range. Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.
How many reflows do you recommend for your modules?
We only recommend reflowing our modules once as it can damage the module and void the warranty.
What are the available CAD file formats?
Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers).
What criteria should be confirmed when soldering Bluetooth modules?
The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.
What is the recommendation for washing BT/BLE modules?
We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.
What is the throughput of your bluetooth modules with the embedded AT command interface?
Our fully-embedded modules have a throughput of around 300-360 kbps. They have an on-board Bluetooth stack and do all of the Bluetooth processing themselves. Bluetooth 2.1 + EDR has a practical transfer rate of 2.1 Mbit/s, but this is not possible on a small embedded module that does not have a powerful PC-type processor.
What's the recommended process to clean modules?
The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.