This part is within the family: BISMS02BI Embedded Bluetooth AT Module Learn more and compare with similar parts on the family page.

Class 1 Bluetooth 2.0 embedded AT module

Specifications

Antenna Type
Internal
Bluetooth Version
v2.0
Bulk or Single
Single
Chipset
CSR BC04
Chipset (Wireless)
QCA (CSR) BC04
Compliance
FCC / IC / CE / MIC
Connector
SMT
Data Rate
Up to 300kbps
Dimension (Height - mm)
5.5 mm
Dimension (Length - mm)
46 mm
Dimension (Width - mm)
15 mm
Frequency Range (Max)
2480 MHz
Frequency Range (Min)
2402 MHz
Input Power
3.3V - 7V
Logical Interfaces
PCM, ADC, GPIO, Serial
OS/Software
AT Commands, Embedded Stack
Physical Interface
SMT
Product Type
Embedded Module
Protocols
AT command set
System Architecture
Hosted
Technology
Bluetooth Classic, Bluetooth 2.0

Documentation

Name Part Type Last Updated
Bluetooth SIG - CPD (BISMS02BI).pdf BISMS02BI Certification 01/17/2019
Bluetooth SIG - QNP (BISMS02BI).pdf BISMS02BI Certification 01/17/2019
RoHS 3 - Bluetooth BISMS02BI Certification 01/04/2022
Release Notes - BISM2 Firmware Version 11.28.1.0.pdf BISMS02BI Documentation 01/17/2019
User Guide - BISM2 Serial Module.pdf BISMS02BI Documentation 01/17/2019
User Guide - BISM2 AT Command Set.pdf BISMS02BI Documentation 01/17/2019
Product Brief - BISMS02BI.pdf BISMS02BI Product Brief 10/12/2021
Datasheet - BISMS02BI.pdf BISMS02BI Datasheet 03/01/2019
PCN - BRBLU03 BISMS02 TRBLU23 Antenna - 20 Dec 16.pdf BISMS02BI Documentation 09/14/2021

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FAQ

What is Laird Connectivity's product lifecycle EOL and PCN policy?

Laird Connectivity is committed to the long-term supply of all its standard embedded wireless modules and packaged products. Laird Connectivity’s products are specifically designed to meet the needs of the industrial and medical markets, which typically require 7 – 10 years product lifecycle. Although Laird Connectivity can’t guarantee that a component used in our products will not be obsoleted and cannot be reasonably substituted, Laird Connectivity can assure customers we will continue to sell our product when we have customer demand and can obtain the necessary components to build our products.

View our full policy here. 

What is the throughput of your bluetooth modules with the embedded AT command interface?

Our fully-embedded modules have a throughput of around 300-360 kbps.  They have an on-board Bluetooth stack and do all of the Bluetooth processing themselves. Bluetooth 2.1 + EDR has a practical transfer rate of 2.1 Mbit/s, but this is not possible on a small embedded module that does not have a powerful PC-type processor.

What is the recommendation for washing BT/BLE modules?

We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.

What criteria should be confirmed when soldering Bluetooth modules?

The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.

Do we recommend conformal coating your modules?

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

How many reflows do you recommend for your modules?

We only recommend reflowing our modules once as it can damage the module and void the warranty.

Are Laird's BT/ BLE Modules "Intrinsically Safe"?

Yes it is possible that Laird's BLE modules could be utilized in a end device that is certified as"Intrinsically Safe". We do not currently have any end customers doing this with all of Laird's BT/BLE modules, some of our BT/BLE modules have been successfully certified by our customers. As a valuable point of information, Intrinsically Safe certifications are detailed and extensive, requiring NDA restricted information on our modules which we can support based on the commercial opportunity. The detailed analysis and testing of the end production solution is the responsibility of the end customer working with their certified test house. 

What are the available CAD file formats?

Laird Connectivity provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Laird Connectivity uses ORCAD for schematics (Gerbers). 

What's the recommended process to clean modules?

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.